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|1. (WO2017033931) CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE|
|Applicants:||SEKISUI CHEMICAL CO., LTD.
|Title:||CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE|
Provided is a conductive material that allows selective arrangement of solder in conductive particles between vertically arranged electrodes, that makes arrangement of solder in conductive particles between horizontally arranged electrodes difficult, and that can enhance conduction reliability and insulation reliability. The conductive material according to the present invention contains, in the outer surface portion of a conductive part thereof, a thermosetting component and a plurality of conductive particles having solder. The minimum value of the viscosity of the conductive material is 25-255 Pa·s at a temperature from 25°C to the melting point °C of the solder in the conductive particles. The average particle diameter of the conductive particles is 3-15 μm. When the average particle diameter μm of the conductive particles is A and the viscosity Pa·s of the conductive material at the melting point °C of the solder in the conductive particles is B, B is not less than (-5A+100) and not more than (-15A+300).