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1. (WO2017033931) CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Pub. No.:    WO/2017/033931    International Application No.:    PCT/JP2016/074528
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Wed Aug 24 01:59:59 CEST 2016
IPC: H01B 1/22
H01B 1/00
H01B 5/16
H01R 4/04
H01R 11/01
Applicants: SEKISUI CHEMICAL CO., LTD.
積水化学工業株式会社
Inventors: ITOU, Masahiro
伊藤 将大
SADANAGA, Shuujirou
定永 周治郎
ISHIZAWA, Hideaki
石澤 英亮
KUBOTA, Takashi
久保田 敬士
Title: CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Abstract:
Provided is a conductive material that allows selective arrangement of solder in conductive particles between vertically arranged electrodes, that makes arrangement of solder in conductive particles between horizontally arranged electrodes difficult, and that can enhance conduction reliability and insulation reliability. The conductive material according to the present invention contains, in the outer surface portion of a conductive part thereof, a thermosetting component and a plurality of conductive particles having solder. The minimum value of the viscosity of the conductive material is 25-255 Pa·s at a temperature from 25°C to the melting point °C of the solder in the conductive particles. The average particle diameter of the conductive particles is 3-15 μm. When the average particle diameter μm of the conductive particles is A and the viscosity Pa·s of the conductive material at the melting point °C of the solder in the conductive particles is B, B is not less than (-5A+100) and not more than (-15A+300).