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1. (WO2017033930) ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

Pub. No.:    WO/2017/033930    International Application No.:    PCT/JP2016/074527
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Wed Aug 24 01:59:59 CEST 2016
IPC: H01B 1/22
C09J 9/02
C09J 201/00
H01B 1/00
H01B 5/16
H01L 21/60
H05K 1/14
H05K 3/32
H05K 3/34
Applicants: SEKISUI CHEMICAL CO., LTD.
積水化学工業株式会社
Inventors: ITOU, Masahiro
伊藤 将大
SADANAGA, Shuujirou
定永 周治郎
ISHIZAWA, Hideaki
石澤 英亮
KUBOTA, Takashi
久保田 敬士
Title: ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Abstract:
[Problem] To provide an electroconductive material with which it is possible to suppress the occurrence of black soot in a cured object, selectively dispose solder in electroconductive particles on an electrode, and improve electroconductive reliability. [Solution] An electroconductive material according to the present invention includes, in an outer surface portion of an electroconductive part, a plurality of electroconductive particles that have solder, a heat-curable component, and flux, and includes as the heat-curable component or the flux a compound having an isocyanuric backbone, the viscosity of the electroconductive material at the melting point of the solder in the electroconductive particles being 0.1-20 Pa·s.