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|1. (WO2017033930) ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE|
|Applicants:||SEKISUI CHEMICAL CO., LTD.
|Title:||ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE|
[Problem] To provide an electroconductive material with which it is possible to suppress the occurrence of black soot in a cured object, selectively dispose solder in electroconductive particles on an electrode, and improve electroconductive reliability. [Solution] An electroconductive material according to the present invention includes, in an outer surface portion of an electroconductive part, a plurality of electroconductive particles that have solder, a heat-curable component, and flux, and includes as the heat-curable component or the flux a compound having an isocyanuric backbone, the viscosity of the electroconductive material at the melting point of the solder in the electroconductive particles being 0.1-20 Pa·s.