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1. (WO2017033834) NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED RESIN FILM, PARTITION, OPTICAL ELEMENT, AND PRODUCTION METHOD THEREFOR
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Pub. No.: WO/2017/033834 International Application No.: PCT/JP2016/074149
Publication Date: 02.03.2017 International Filing Date: 18.08.2016
IPC:
G03F 7/031 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/027 (2006.01) ,H01L 51/44 (2006.01) ,H01L 51/50 (2006.01) ,H05B 33/10 (2006.01) ,H05B 33/12 (2006.01) ,H05B 33/22 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
028
with photosensitivity-increasing substances, e.g. photoinitiators
031
Organic compounds not covered by group G03F7/02967
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
027
Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
42
specially adapted for sensing infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation; specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
44
Details of devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50
specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
10
Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
B
ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
33
Electroluminescent light sources
12
Light sources with substantially two-dimensional radiating surfaces
22
characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
Applicants:
旭硝子株式会社 ASAHI GLASS COMPANY, LIMITED [JP/JP]; 東京都千代田区丸の内一丁目5番1号 5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1008405, JP
Inventors:
川島 正行 KAWASHIMA Masayuki; JP
Agent:
特許業務法人サクラ国際特許事務所 SAKURA PATENT OFFICE, P.C.; 東京都千代田区内神田一丁目18番14号 ヨシザワビル6階 6F Yoshizawa Bldg., 18-14, Uchikanda 1-chome, Chiyoda-ku, Tokyo 1010047, JP
Priority Data:
2015-16378621.08.2015JP
Title (EN) NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED RESIN FILM, PARTITION, OPTICAL ELEMENT, AND PRODUCTION METHOD THEREFOR
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE DE TYPE NÉGATIF, FILM DE RÉSINE DURCI, SÉPARATION, ÉLÉMENT OPTIQUE ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(JA) ネガ型感光性樹脂組成物、樹脂硬化膜、隔壁ならびに光学素子およびその製造方法
Abstract:
(EN) Provided are: a negative-type photosensitive resin composition that is for an optical element, that has good ink repellency, and that makes it possible to reduce residue in an opening; a cured resin film that is for an optical element and that has good ink repellency; a partition that is for an optical element and that makes it possible to form a highly precise pattern; and an optical element comprising the partition. The negative-type photosensitive resin composition contains a photocurable alkali-soluble resin or alkali-soluble monomer, a photopolymerization initiator comprising an α-hydroxyalkylphenone compound, and an ink repellent. The present invention also provides a cured film formed using the negative-type photosensitive resin composition, a partition, an organic EL element comprising a plurality of dots and the partition positioned between adjacent dots on a substrate surface, a quantum dot display, a TFT array, and a thin-film solar cell.
(FR) La présente invention concerne : une composition de résine photosensible de type négatif destinée à un élément optique, présentant une bonne aptitude à repousser l’encre et permettant de réduire la formation de résidus dans une ouverture ; un film de résine durci destiné à un élément optique et présentant une bonne aptitude à repousser l’encre ; une séparation destinée à un élément optique et permettant de former un motif d’une grande précision ; et un élément optique comprenant la séparation. La composition de résine photosensible de type négatif renferme une résine photodurcissable soluble dans les alcalis ou un monomère photodurcissable soluble dans les alcalis, un initiateur de photopolymérisation comprenant un composé α-hydroxyalkylphénone et un agent repoussant l’encre. La présente invention porte également sur un film durci formé à l’aide de la composition de résine photosensible de type négatif, une séparation, un élément électroluminescent organique comprenant une pluralité de points et la séparation placée entre des points adjacents sur une surface formant substrat, un affichage à points quantiques, une matrice TFT et une cellule solaire en couches minces.
(JA) 良好な撥インク性を有するとともに開口部における残渣の低減が可能な光学素子用のネガ型感光性樹脂組成物、良好な撥インク性を有する光学素子用の樹脂硬化膜、精度の高いパターンの形成が可能な光学素子用の隔壁および、該隔壁を有する光学素子の提供。光硬化性を有するアルカリ可溶性樹脂またはアルカリ可溶性単量体と、α-ヒドロキシアルキルフェノン系の化合物からなる光重合開始剤と、撥インク剤とを含有するネガ型感光性樹脂組成物、該ネガ型感光性樹脂組成物を用いて形成される硬化膜、隔壁、および基板表面に複数のドットと隣接するドット間に位置する該隔壁とを有する有機EL素子、量子ドットディスプレイ、TFTアレイ、薄膜太陽電池。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)