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1. (WO2017033795) ELECTRICAL CONTACT AND SOCKET FOR ELECTRICAL COMPONENT

Pub. No.:    WO/2017/033795    International Application No.:    PCT/JP2016/073875
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Wed Aug 17 01:59:59 CEST 2016
IPC: H01R 13/03
G01R 1/073
G01R 31/26
Applicants: ENPLAS CORPORATION
株式会社エンプラス
Inventors: ODA, Takahiro
小田 享弘
Title: ELECTRICAL CONTACT AND SOCKET FOR ELECTRICAL COMPONENT
Abstract:
In the present invention, a socket body in which an IC package is contained is provided with a contact pin 32, and is electrically contacted with a connection terminal of the contained IC package. The contact pin 32 has a plurality of layers laminated on the surface of a base material 62 having electrical conductivity, specifically: an under layer 64 formed as an Ni plating layer over the base material 62; a first surface layer 68 formed as a Pd-Ni alloy plating layer over the under layer 64; a second surface layer 70 formed as an Ni plating layer over the first surface layer 68, in which the speed at which the Sn of the connection terminal diffuses is slower than with a conventional Ag plating layer; and an outermost surface layer 72 formed as an Au plating layer over the second surface layer 70 and serving as an electrical contact layer.