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1. (WO2017033793) CHIP RESISTOR AND METHOD FOR MANUFACTURING CHIP RESISTOR

Pub. No.:    WO/2017/033793    International Application No.:    PCT/JP2016/073847
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Tue Aug 16 01:59:59 CEST 2016
IPC: H01C 1/142
H01C 1/034
H01C 7/00
Applicants: KOA CORPORATION
KOA株式会社
Inventors: MATSUMOTO Kentaro
松本 健太郎
ITO Takashi
伊藤 隆志
Title: CHIP RESISTOR AND METHOD FOR MANUFACTURING CHIP RESISTOR
Abstract:
This chip resistor is provided with: an insulating substrate 1 that is formed from a ceramic and has the shape of a rectangular parallelepiped; a pair of front electrodes 2 that are arranged on both end portions of the front surface of the insulating substrate 1 in the longitudinal direction; a resistor 3 that connects the front electrodes 2 with each other; a protective film 4 that is formed from a resin and covers the entire front surface of the insulating substrate 1 including the front electrodes 2 and the resistor 3; an auxiliary film 5 that is formed from a resin and covers the entire back surface of the insulating substrate 1; and a pair of end face electrodes 6 that are arranged on both end surfaces of the insulating substrate 1 in the longitudinal direction and are electrically connected to the front electrodes 2. The end face electrodes 6 are formed into the shape of a cap so as to cover the upper surface of the protective film 4, the lower surface of the auxiliary film 5 and both end portions of the both lateral surfaces of the insulating substrate 1 in the longitudinal direction.