Some content of this application is unavailable at the moment.
If this situation persist, please contact us atFeedback&Contact
1. (WO2017033713) PRINTED-WIRING BOARD SUBSTRATE, PRINTED-WIRING BOARD, AND METHOD FOR PRODUCING PRINTED-WIRING BOARD SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/033713 International Application No.: PCT/JP2016/073212
Publication Date: 02.03.2017 International Filing Date: 06.08.2016
IPC:
H05K 3/38 (2006.01)
[IPC code unknown for H05K 3/38]
Applicants:
住友電気工業株式会社 SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 大阪府大阪市中央区北浜四丁目5番33号 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041, JP
住友電工プリントサーキット株式会社 SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. [JP/JP]; 滋賀県甲賀市水口町ひのきが丘30番地 30, Hinokigaoka, Minakuchi-cho, Koka-shi, Shiga 5280068, JP
住友電工ファインポリマー株式会社 SUMITOMO ELECTRIC FINE POLYMER, INC. [JP/JP]; 大阪府泉南郡熊取町朝代西一丁目950番地 950, Asashiro-nishi 1-chome, Kumatori-cho, Sennan-gun, Osaka 5900458, JP
Inventors:
山中 佑一郎 YAMANAKA, Yuichiro; JP
岡 良雄 OKA, Yoshio; JP
木谷 聡志 KIYA, Satoshi; JP
内田 淑文 UCHITA, Yoshifumi; JP
中林 誠 NAKABAYASHI, Makoto; JP
Agent:
中田 元己 NAKATA, Motomi; JP
森田 剛史 MORITA, Takeshi; JP
高城 政浩 TAKAGI, Masahiro; JP
緒方 大介 OGATA, Daisuke; JP
Priority Data:
2015-16423421.08.2015JP
Title (EN) PRINTED-WIRING BOARD SUBSTRATE, PRINTED-WIRING BOARD, AND METHOD FOR PRODUCING PRINTED-WIRING BOARD SUBSTRATE
(FR) SUBSTRAT DE CARTE DE CIRCUIT IMPRIMÉ, CARTE DE CIRCUIT IMPRIMÉ, ET PROCÉDÉ DE PRODUCTION DE SUBSTRAT DE CARTE DE CIRCUIT IMPRIMÉ
(JA) プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
Abstract:
(EN) A printed-wiring board substrate according to one aspect of the present invention is provided with a base film and a metal layer disposed on at least one surface of the base film, and has a nitrogen abundance of 1-10 atomic% per unit area as determined on the basis of the peak area of N1s spectrum in XPS analysis performed on the base film surface that is exposed following the removal of the metal layer by etching using an acidic solution.
(FR) Selon un aspect de la présente invention, un substrat de carte de circuit imprimé comprend un film de base et une couche métallique disposée sur au moins une surface du film de base, et a une abondance d'azote de 1 à 10 % atomique par unité de surface comme défini en fonction de l'aire de pic de spectre N1s dans une analyse XPS effectuée sur la surface de film de base qui est exposée après le retrait de la couche métallique par attaque chimique à l'aide d'une solution acide.
(JA) 本発明の一態様に係るプリント配線板用基板は、ベースフィルムと、このベースフィルムの少なくとも一方の面に配設されている金属層とを備え、酸性溶液を用いたエッチングにより金属層除去後に露出するベースフィルム表面のXPS分析におけるN1sのスペクトルのピーク面積に基づいて求められる窒素の単位面積当たりの存在量が1atomic%以上10atomic%以下である。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)