Search International and National Patent Collections

1. (WO2017033639) METHOD FOR PROCESSING SUBSTRATE, COMPOSITION FOR TEMPORARY FIXING, AND SEMICONDUCTOR DEVICE

Pub. No.:    WO/2017/033639    International Application No.:    PCT/JP2016/071548
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Sat Jul 23 01:59:59 CEST 2016
IPC: H01L 21/02
H01L 21/304
Applicants: JSR CORPORATION
JSR株式会社
Inventors: MARUYAMA, Youichirou
丸山 洋一郎
MORI, Takashi
森 隆
MIZUNO, Hikaru
水野 光
Title: METHOD FOR PROCESSING SUBSTRATE, COMPOSITION FOR TEMPORARY FIXING, AND SEMICONDUCTOR DEVICE
Abstract:
[Problem] To provide a method for processing a substrate, which is capable of easily removing a bonding layer by peeling and/or by solvent cleaning, said bonding layer remaining on a substrate after separation of the substrate from a supporting body during a process wherein the substrate is processed/transferred, while being temporarily fixed on the supporting body via a temporary fixing material. [Solution] A method for processing a substrate, which sequentially comprises, in the following order: a step for forming a laminate which has a supporting body, a temporary fixing material and a substrate, and wherein the temporary fixing material has a temporary fixing material layer (I) that is in contact with the supporting body-side surface of the substrate and is formed from a composition containing at least one polymer selected from among polybenzoxazole precursors and polybenzoxazoles and a temporary fixing material layer (II) that is formed on the supporting body-side surface of the layer (I) and contains a light absorbent; a step for processing the substrate and/or transferring the laminate; a step for irradiating the layer (II) with light; a step for separating the substrate from the supporting body; and a step for removing the layer (I) from the substrate.