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1. (WO2017033564) HIGH-FREQUENCY MODULE

Pub. No.:    WO/2017/033564    International Application No.:    PCT/JP2016/069227
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Thu Jun 30 01:59:59 CEST 2016
IPC: H04B 1/38
Applicants: MURATA MANUFACTURING CO., LTD.
株式会社村田製作所
Inventors: HITOMI, Shinya
人見 伸也
OBIYA, Hidenori
帯屋 秀典
NAKAJIMA, Reiji
中嶋 礼滋
Title: HIGH-FREQUENCY MODULE
Abstract:
This high-frequency module (1) is provided with: a first substrate (101); a second substrate (102) opposing the first substrate (101); support bodies (103) for supporting the first substrate (101) and the second substrate (102); and a plurality of high-frequency circuit components disposed in an inner space formed by the first substrate (101), the second substrate (102) and the support bodies (103) and on both opposing main surfaces of the first substrate (101) and the second substrate (102). The plurality of high-frequency circuit components includes power amplifier elements which constitute a power amplifier circuit (16).