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1. (WO2017033525) HIGH FREQUENCY DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/033525 International Application No.: PCT/JP2016/066968
Publication Date: 02.03.2017 International Filing Date: 07.06.2016
Chapter 2 Demand Filed: 07.11.2016
IPC:
H01Q 23/00 (2006.01) ,H01P 3/08 (2006.01) ,H01P 5/08 (2006.01) ,H01Q 13/08 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
23
Aerials with active circuits or circuit elements integrated within them or attached to them
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
3
Waveguides; Transmission lines of the waveguide type
02
with two longitudinal conductors
08
Microstrips; Strip lines
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
P
WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE
5
Coupling devices of the waveguide type
08
for linking lines or devices of different kinds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
Q
AERIALS
13
Waveguide horns or mouths; Slot aerials; Leaky-waveguide aerials; Equivalent structures causing radiation along the transmission path of a guided wave
08
Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
Applicants:
シャープ株式会社 SHARP KABUSHIKI KAISHA [JP/JP]; 大阪府堺市堺区匠町1番地 1, Takumi-cho, Sakai-ku, Sakai City, Osaka 5908522, JP
Inventors:
末松 英治 SUEMATSU, Eiji; --
佐藤 啓介 SATOH, Keisuke; --
Agent:
特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK; 大阪府大阪市北区天神橋2丁目北2番6号 大和南森町ビル Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041, JP
Priority Data:
2015-16690626.08.2015JP
Title (EN) HIGH FREQUENCY DEVICE
(FR) DISPOSITIF HAUTE FRÉQUENCE
(JA) 高周波装置
Abstract:
(EN) Reduction of the area and size of a high frequency device. A high frequency device which comprises: a first substrate (1) having a first surface (1a) on which a circuit part is formed and a second surface (1b) on which a ground conductor is formed; a second substrate (2) having a third surface (2a) on which an antenna is formed and a fourth surface (2b) on which a second ground conductor is formed; and a conductor plate (3). The conductor plate (3) is sandwiched between the second surface (1b) and the fourth surface (2b).
(FR) La présente invention vise à réduire la superficie et la taille d'un dispositif haute fréquence. L'invention porte sur un dispositif haute fréquence qui comprend : un premier substrat (1) présentant une première surface (1a) sur laquelle une partie de circuit est formée et une deuxième surface (1b) sur laquelle un conducteur de masse est formé ; un second substrat (2) présentant une troisième surface (2a) sur laquelle une antenne est formée et une quatrième surface (2b) sur laquelle un second conducteur de masse est formé ; et une plaque conductrice (3). La plaque conductrice (3) est prise en sandwich entre la deuxième surface (1b) et la quatrième surface (2b).
(JA) 高周波装置の小面積化および小型化。回路部が形成されている第1面(1a)および接地導体が形成されている第2面(1b)を有する第1基板(1)と、アンテナが形成されている第3面(2a)および第2接地導体が形成されている第4面(2b)を有する第2基板(2)と、導体プレート(3)と、を含み、導体プレート(3)が、第2面(1b)と第4面(2b)との間に挟まれている。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)