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1. (WO2017033504) OPTICAL ELEMENT MODULE AND METHOD FOR MANUFACTURING OPTICAL ELEMENT MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/033504 International Application No.: PCT/JP2016/063897
Publication Date: 02.03.2017 International Filing Date: 10.05.2016
IPC:
H01L 23/02 (2006.01) ,H01L 23/20 (2006.01) ,H01L 27/14 (2006.01) ,H01L 31/02 (2006.01) ,H01L 33/48 (2010.01) ,H01S 5/022 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
16
Fillings or auxiliary members in containers, e.g. centering rings
18
Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
20
gaseous at the normal operating temperature of the device
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
Applicants:
株式会社フジクラ FUJIKURA LTD. [JP/JP]; 東京都江東区木場1丁目5番1号 1-5-1, Kiba, Koto-ku, Tokyo 1358512, JP
Inventors:
岩田 幸一郎 IWATA, Koichiro; JP
Agent:
特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK; 大阪府大阪市北区天神橋2丁目北2番6号 大和南森町ビル Daiwa Minamimorimachi Building, 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-shi, Osaka 5300041, JP
Priority Data:
2015-16419721.08.2015JP
Title (EN) OPTICAL ELEMENT MODULE AND METHOD FOR MANUFACTURING OPTICAL ELEMENT MODULE
(FR) MODULE D'ÉLÉMENT OPTIQUE ET PROCÉDÉ DE FABRICATION DE MODULE D'ÉLÉMENT OPTIQUE
(JA) 光学素子モジュール、光学素子モジュールの製造方法
Abstract:
(EN) Provided is an optical element module in which a foreign substance and water remaining in the module can be adsorbed and absorbed with a simple configuration requiring no complicated manufacturing step. This optical element module (101) having an optical element 1 mounted in a sealed housing (11, 12) has self-adhesiveness. Polyurethane (13) having a predetermined shape is fixed in the optical element module (101) by the self-adhesiveness.
(FR) L'invention concerne un module d'élément optique dans lequel une substance étrangère et de l'eau restant dans le module peuvent être adsorbées et absorbées avec une configuration simple ne nécessitant aucune étape de fabrication compliquée. Ce module d'élément optique (101), comprenant un élément optique (1) monté dans un boîtier scellé (11, 12), possède de l'auto-adhésivité. Du polyuréthane (13) ayant une forme prédéterminée est fixé dans le module d'élément optique (101) par l'auto-adhésivité.
(JA) 煩雑な製造工程を必要としない簡単な構成で、モジュール内に残留した異物の吸着及び水分の吸収を可能とする光学素子モジュールを提供する。密封された筐体(11,12)内に、光学素子1が実装された光学素子モジュール(101)であって、自己粘着性を有し、かつ所定形状を備えたポリウレタン(13)が、上記自己粘着性によって上記光学素子モジュール(101)内に固定されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)