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1. (WO2017033462) GLASS PLATE PROCESSING DEVICE
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Pub. No.: WO/2017/033462 International Application No.: PCT/JP2016/003864
Publication Date: 02.03.2017 International Filing Date: 24.08.2016
IPC:
B24B 9/10 (2006.01) ,B24B 7/24 (2006.01) ,C03B 33/03 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
9
Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
02
characterised by a special design with respect to properties of materials specific to articles to be ground
06
of non-metallic inorganic material, e.g. stone, ceramics, porcelain
08
of glass
10
of plate glass
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
7
Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
20
characterised by a special design with respect to properties of the material of non-metallic articles to be ground
22
for grinding inorganic material, e.g. stone, ceramics, porcelain
24
for grinding or polishing glass
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
B
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
33
Severing cooled glass
02
Cutting or splitting sheet glass; Apparatus or machines therefor
023
the sheet being in a horizontal position
03
Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
Applicants:
坂東機工株式会社 BANDO KIKO CO., LTD. [JP/JP]; 徳島県徳島市金沢2丁目4番60号 4-60, Kanazawa 2-chome, Tokushima-shi, Tokushima 7700871, JP
Inventors:
坂東 和明 BANDO, Kazuaki; JP
Agent:
高田 武志 TAKADA, Takeshi; JP
Priority Data:
2015-16626725.08.2015JP
Title (EN) GLASS PLATE PROCESSING DEVICE
(FR) DISPOSITIF DE TRAITEMENT DE PLAQUE DE VERRE
(JA) ガラス板加工装置
Abstract:
(EN) A glass plate processing device 1 comprises: a scribe line forming device 5; glass plate breaking devices 15A, 15B; glass plate peripheral edge grinding devices 19A, 19B; and a glass plate conveying device 20 that carries glass plates 2 two by two into and out of the scribe line forming device 5, the glass plate breaking devices 15A, 15B, and the glass plate peripheral edge grinding devices 19A, 19B. The glass plate peripheral edge grinding devices 19A, 19B are configured such that, when simultaneously grinding the peripheral edges of the glass plates 2, the glass plates are independently controlled and moved in an XY coordinate system.
(FR) Dispositif de traitement 1 de plaque de verre comprenant : un dispositif de formation 5 de ligne de découpe ; des dispositifs de rupture 15A, 15B de plaque de verre ; des dispositifs de meulage 19A, 19B de bord périphérique de plaque de verre ; et un dispositif de transport 20 de plaque de verre qui porte les plaques de verre deux par deux à l'intérieur et à l'extérieur du dispositif de formage 5 de ligne de découpe, des dispositifs de rupture 15A, 15B de plaque de verre et des dispositifs de meulage 19A, 19B de bord périphérique de plaque de verre. Les dispositifs de meulage 19A, 19B de bord périphérique de plaque de verre sont conçus de telle sorte que, lors du meulage simultané des bords périphériques des plaques de verre 2, les plaques de verre sont indépendamment commandées et déplacées dans un système de coordonnées XY.
(JA) ガラス板加工装置1は、スクライブ線形成装置5と、ガラス板折割装置15A、15Bと、ガラス板周縁研削装置19A、19Bと、これらスクライブ線形成装置5、ガラス板折割装置15A、15B及びガラス板周縁研削装置19A、19Bの夫々に対してガラス板2を2枚ずつ搬入及び搬出するガラス板搬送装置20とを具備しており、ガラス板周縁研削装置19A、19Bにおけるガラス板2に対する周縁の同時的な研削におけるXY座標系の制御移動が互いに独立して行われるようになっている。 
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)