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|1. (WO2017033409) POLISHING APPARATUS|
|Applicants:||SHIN-ETSU HANDOTAI CO.,LTD.
FUJIKOSHI MACHINERY CORP.
The present invention is a polishing apparatus equipped with a surface plate on which a polishing fabric is affixed, a polishing head for holding a wafer, a tank for storing an abrasive, an abrasive supply mechanism for supplying the abrasive stored in the tank to the polishing fabric, a waste fluid receptacle for recovering abrasive flowing down from the surface plate, and a circulating mechanism connected to the waste fluid receptacle for supplying the abrasive recovered in the waste fluid receptacle into the tank. The polishing apparatus supplies abrasive to the polishing fabric from inside the tank using the abrasive supply mechanism, recovers used abrasive flowing down from the surface plate in the waste fluid receptacle, and polishes the surface of a wafer held by the polishing head by rubbing same on the polishing fabric while circulating the abrasive by supplying recovered abrasive into the tank. The polishing apparatus is characterized in that the waste fluid receptacle is fixed to the surface plate. As a result, it is possible to provide a polishing apparatus wherein when recovering abrasive that is to be re-used, mixing with other solutions is limited and worsening of abrasive recovery efficiency is limited, and that is easy to maintain.