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1. (WO2017033409) POLISHING APPARATUS

Pub. No.:    WO/2017/033409    International Application No.:    PCT/JP2016/003575
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Thu Aug 04 01:59:59 CEST 2016
IPC: B24B 37/00
B24B 37/12
B24B 57/02
H01L 21/304
Applicants: SHIN-ETSU HANDOTAI CO.,LTD.
信越半導体株式会社
FUJIKOSHI MACHINERY CORP.
不二越機械工業株式会社
Inventors: SATO, Michito
佐藤 三千登
UENO, Junichi
上野 淳一
ISHII, Kaoru
石井 薫
KANAI, Yosuke
金井 洋介
NAKANISHI, Yuya
中西 勇矢
Title: POLISHING APPARATUS
Abstract:
The present invention is a polishing apparatus equipped with a surface plate on which a polishing fabric is affixed, a polishing head for holding a wafer, a tank for storing an abrasive, an abrasive supply mechanism for supplying the abrasive stored in the tank to the polishing fabric, a waste fluid receptacle for recovering abrasive flowing down from the surface plate, and a circulating mechanism connected to the waste fluid receptacle for supplying the abrasive recovered in the waste fluid receptacle into the tank. The polishing apparatus supplies abrasive to the polishing fabric from inside the tank using the abrasive supply mechanism, recovers used abrasive flowing down from the surface plate in the waste fluid receptacle, and polishes the surface of a wafer held by the polishing head by rubbing same on the polishing fabric while circulating the abrasive by supplying recovered abrasive into the tank. The polishing apparatus is characterized in that the waste fluid receptacle is fixed to the surface plate. As a result, it is possible to provide a polishing apparatus wherein when recovering abrasive that is to be re-used, mixing with other solutions is limited and worsening of abrasive recovery efficiency is limited, and that is easy to maintain.