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1. (WO2017033334) MATCHING CIRCUIT AND HIGH-FREQUENCY AMPLIFIER

Pub. No.:    WO/2017/033334    International Application No.:    PCT/JP2015/074248
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Fri Aug 28 01:59:59 CEST 2015
IPC: H03H 7/38
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: KAMIOKA, Jun
神岡 純
YAMANAKA, Koji
山中 宏治
HANGAI, Masatake
半谷 政毅
Title: MATCHING CIRCUIT AND HIGH-FREQUENCY AMPLIFIER
Abstract:
The present invention is configured in such a way that a bonding wire (19) connects one end of a main line (13) formed on a dielectric substrate (11) to one end of a main line (16) formed on a dielectric substrate (12), and a bonding wire (27) connects the other end of a branched line (21) formed on the dielectric substrate (12) to the other end of a branched line (23) formed on the dielectric substrate (11). This configuration can suppress impedance mismatching caused by a variation in distance between the dielectric substrate (11) and the dielectric substrate (12) due to an inconsistency in assembly occurring during manufacturing.