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1. (WO2017033295) STRUCTURE

Pub. No.:    WO/2017/033295    International Application No.:    PCT/JP2015/073926
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Thu Aug 27 01:59:59 CEST 2015
IPC: H01L 23/29
H01L 25/07
H01L 25/18
Applicants: HITACHI AUTOMOTIVE SYSTEMS, LTD.
日立オートモティブシステムズ株式会社
Inventors: TSUYUNO Nobutake
露野 円丈
TOKUYAMA Takeshi
徳山 健
IDE Eiichi
井出 英一
Title: STRUCTURE
Abstract:
The purpose of the present invention is to provide a structure, specifically, a power semiconductor module, wherein a bypass flow of a cooling medium is suppressed, and cooling efficiency is improved. A structure of the present invention is provided with a heat dissipating plate thermally connected to a heat generating body, and a resin region having a resin material that fixes the heat generating body and the heat dissipating plate. The heat dissipating plate has: a fin section having a plurality of fins, which are formed protruding from the heat dissipating surface of the heat dissipating plate, said fins being exposed from the sealing resin material; and a wall section, which is formed protruding from the heat dissipating surface to the same side to which the fins protrude, said wall section separating the fin section and the resin region from each other.