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|1. (WO2017033295) STRUCTURE|
|Applicants:||HITACHI AUTOMOTIVE SYSTEMS, LTD.
The purpose of the present invention is to provide a structure, specifically, a power semiconductor module, wherein a bypass flow of a cooling medium is suppressed, and cooling efficiency is improved. A structure of the present invention is provided with a heat dissipating plate thermally connected to a heat generating body, and a resin region having a resin material that fixes the heat generating body and the heat dissipating plate. The heat dissipating plate has: a fin section having a plurality of fins, which are formed protruding from the heat dissipating surface of the heat dissipating plate, said fins being exposed from the sealing resin material; and a wall section, which is formed protruding from the heat dissipating surface to the same side to which the fins protrude, said wall section separating the fin section and the resin region from each other.