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1. (WO2017032771) DEVICE AND METHOD FOR PRODUCING A DEVICE
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Pub. No.: WO/2017/032771 International Application No.: PCT/EP2016/069890
Publication Date: 02.03.2017 International Filing Date: 23.08.2016
IPC:
H01L 23/485 (2006.01) ,H01L 21/60 (2006.01) ,H01L 33/00 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
482
consisting of lead-in layers inseparably applied to the semiconductor body
485
consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Applicants:
OSRAM OPTO SEMICONDUCTORS GMBH [DE/DE]; Leibnizstr. 4 93055 Regensburg, DE
Inventors:
BEHR, Barbara; DE
WENDT, Mathias; DE
ZENGER, Marcus; DE
Agent:
EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH; Schloßschmidstr. 5 80639 München, DE
Priority Data:
10 2015 114 086.125.08.2015DE
Title (EN) DEVICE AND METHOD FOR PRODUCING A DEVICE
(FR) COMPOSANT ET PROCÉDÉ DE FABRICATION D'UN COMPOSANT
(DE) BAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES BAUELEMENTS
Abstract:
(EN) The invention relates to a device (100) having a first component (1), a second component (2), a connecting component (3) which is provided directly between the first component (1) and the second component (2), the connecting element (3) having at least a first metal (Me1) which: is in the form of an adhesion layer (4) provided directly on the first component (1) and/or the second component (2); is in the form of a diffusion barrier (5); is part of a first phase (31) and/or a second phase (32) of the connecting element (3), wherein the first and/or the second phase (31, 32) comprises, in addition to the first metal (Me1), also other metals that are different from the first metal, wherein the concentration (c11) of the first metal (Me1) in the first phase (31) is larger than the concentration (c25) of the first metal (Me1) in the second phase (32).
(FR) L’invention concerne un composant (100) comprenant un premier élément (1), un second élément (2), un élément de liaison (3) situé directement entre le premier élément (1) et la second élément (2), l'élément de liaison (3) contenant au moins un premier métal (Me1), qui se présente sous la forme d’une couche adhésive (4) directement située sur le premier élément (1) et/ou le second élément (2), qui se présente sous la forme d’une barrière de diffusion (5), et qui est le constituant d’une première phase (31) et/ou d’une seconde phase (32) de l'élément de liaison (3), les première et/ou seconde phases (31, 32) contenant chacune, outre le premier métal (Me1) également d'autres métaux différents du premier métal, la concentration (c11) du premier métal (Me1) dans la première phase (31) étant plus élevée que la concentration (c25) du premier métal (Me1) dans la seconde phase (32).
(DE) Die Erfindung betrifft ein Bauelement (100) aufweisend eine erste Komponente (1), eine zweite Komponente (2), ein Verbindungselement (3), das direkt zwischen der ersten Komponente (1) und der zweiten Komponente (2) angeordnet ist, wobei das Verbindungselement (3) zumindest ein erstes Metall (Me1) aufweist, das als eine Haftschicht (4) ausgeformt ist, die direkt an der ersten Komponente (1) und/oder zweiten Komponente (2) angeordnet ist, das als Diffusionsbarriere (5) ausgeformt ist, das Bestandteil einer ersten Phase (31) und/oder einer zweiten Phase (32) des Verbindungselements (3) ist, wobei die erste und/oder zweite Phase (31, 32) jeweils neben dem ersten Metall (Me1) noch weitere von dem ersten Metall verschiedene Metalle umfasst, wobei die Konzentration (c11) des ersten Metalls (Me1) in der ersten Phase (31) größer ist als die Konzentration (c25) des ersten Metalls (Me1) in der zweiten Phase (32).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)