Search International and National Patent Collections

1. (WO2017032763) DEVICE AND METHOD FOR MACHINING A SEMICONDUCTOR SUBSTRATE BY MEANS OF LASER RADIATION

Pub. No.:    WO/2017/032763    International Application No.:    PCT/EP2016/069867
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Wed Aug 24 01:59:59 CEST 2016
IPC: H01L 31/18
B23K 26/364
H01L 21/20
Applicants: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E. V.
Inventors: NEKARDA, Jan
BRAND, Andreas
GRAF, Martin
Title: DEVICE AND METHOD FOR MACHINING A SEMICONDUCTOR SUBSTRATE BY MEANS OF LASER RADIATION
Abstract:
The invention relates to a method for machining a semiconductor substrate, in particular a semiconductor substrate for producing a photovoltaic solar cell. Said method comprises a laser machining step in which the semiconductor substrate is locally subjected to machining laser radiation from a machining laser radiation source in a machining area. The invention is characterised in that before and/or during the laser machining step, the semiconductor substrate is subjected to an illumination intensity greater than 50,000 w/m2 in a conditioning area by means of conditioning laser radiation from a conditioning laser radiation source.