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1. (WO2017032404) APPARATUS FOR VACUUM SPUTTER DEPOSITION AND METHOD THEREFOR

Pub. No.:    WO/2017/032404    International Application No.:    PCT/EP2015/069364
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Tue Aug 25 01:59:59 CEST 2015
IPC: H01J 37/32
H01J 37/34
F23N 5/24
C23C 14/00
C23C 14/34
F23M 11/00
Applicants: APPLIED MATERIALS, INC.
SEVERIN, Daniel
GEBELE, Thomas
LEIPNITZ, Thomas
Inventors: SEVERIN, Daniel
GEBELE, Thomas
LEIPNITZ, Thomas
Title: APPARATUS FOR VACUUM SPUTTER DEPOSITION AND METHOD THEREFOR
Abstract:
An apparatus (100) for vacuum sputter deposition is described. The apparatus includes a vacuum chamber (110); three or more sputter cathodes within the vacuum chamber (110) for sputtering material on a substrate (200); a gas distribution system (130) for providing a processing gas including H2 to the vacuum chamber (110); a vacuum system (140) for providing a vacuum inside the vacuum chamber (110); and a safety arrangement (160) for reducing the risk of an oxy-hydrogen explosion, wherein the safety arrangement (160) comprises a dilution gas feeding unit (165) connected to the vacuum system (160) for dilution of the H2-content of the processing gas (111).