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1. (WO2017032356) POWER SEMICONDUCTOR DEVICE MODULE HAVING A PRESSURE PLATE THAT FORMS A BASIN
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Pub. No.: WO/2017/032356 International Application No.: PCT/DE2016/000328
Publication Date: 02.03.2017 International Filing Date: 24.08.2016
IPC:
H01L 23/00 (2006.01) ,H01L 25/07 (2006.01) ,H01L 23/36 (2006.01) ,H01L 23/40 (2006.01) ,H01L 23/498 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
36
Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
40
Mountings or securing means for detachable cooling or heating arrangements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
Applicants:
INFINEON TECHNOLOGIES BIPOLAR GMBH & CO KG [DE/DE]; Max-Planck-Str. 5 59581 Warstein, DE
Inventors:
NÜBEL, Harald; DE
KRAUSE, Elmar; DE
BARTHELMESS, Reiner; DE
Agent:
LOHMANNS, Bernard; Benrather Schlossallee 49-53 40597 Düsseldorf-Benrath, DE
Priority Data:
DE 10 2015 114 046.225.08.2015DE
Title (EN) POWER SEMICONDUCTOR DEVICE MODULE HAVING A PRESSURE PLATE THAT FORMS A BASIN
(FR) MODULE COMPOSANT SEMICONDUCTEUR DE PUISSANCE POURVU D'UNE PLAQUE D'ABSORPTION DE PRESSION FORMANT UNE CUVETTE
(DE) LEISTUNGSHALBLEITERBAUELEMENTMODUL MIT EINER EIN BECKEN AUSBILDENDEN DRUCKPLATTE
Abstract:
(EN) The invention relates to a power semiconductor device module (20) for fastening a cooling body (18), comprising: - at least one power semiconductor device (12); - contacting means (11, 16) for electrically interconnecting the at least one power semiconductor device (12); - a pressure plate (1) which is thermoconducting at least in portions thereof; - pretensioning means (13, 14, 19) which are designed to pretension the contacting means (11, 16) against the power semiconductor device (12) for the purpose of electrical interconnection, and the power semiconductor device (12) against the at least one thermoconducting portion of the pressure plate (2) which is thermoconducting at least in portions thereof, preferably in the direction of the cooling body (18), for the purpose of thermal contacting; - fastening means (1, 7, 17) for fastening the pretensioning means to the cooling body (18), said fastening means (1, 7, 17) encircling the pressure plate (1) which is thermoconducting at least in portions thereof; characterized in that the pressure plate (1) which is thermoconducting at least in portions thereof forms at least one basin (9) that surrounds the power semiconductor (12).
(FR) L'invention concerne un module composant semiconducteur de puissance (20) destiné à être fixé sur un dissipateur thermique (18), présentant : - au moins un composant semiconducteur de puissance (12) : - des moyens de mise en contact (11, 16) servant à mettre en contact électrique ledit au moins un composant semiconducteur de puissance (12) ; - une plaque d'absorption de pression (1) conçue de façon thermoconductrice au moins dans certaines zones ; - des moyens de précontrainte (13, 14, 19) conçus pour précontraindre les moyens de mise en contact (11, 16) contre le composant semiconducteur de puissance (12) pour la mise en contact électrique et le composant semiconducteur de puissance (12) contre ladite au moins une zone thermoconductrice de la dite au moins une plaque d'absorption de pression (1) conçue de façon thermoconductrice au moins dans certaines zones, de préférence en direction du dissipateur thermique (18), pour la mise en contact thermique ; - des moyens de fixation (1, 7, 17) pour la fixation des moyens de précontrainte sur le dissipateur thermique (18), ces moyens de fixation (1, 7, 17) entourant la plaque d'absorption de pression (1) conçue de façon thermoconductrice au moins dans certaines zones. Ce module composant semiconducteur de puissance est caractérisé en ce que ladite plaque d'absorption de pression (1) conçue de façon thermoconductrice au moins dans certaines zones forme au moins une cuvette (9) entourant le semiconducteur de puissance (12).
(DE) Die Erfindung betrifft ein Leistungshalbleiterbauelementmodul (20) zur Befestigung an einem Kühlkörper (18), aufweisend: - wenigstens ein Leistungshalbleiterbauelement (12); - Kontaktierungsmittel (11, 16), um das wenigstens eine Leistungshalbleiterbauelement (12) elektrisch zu kontaktieren; - eine wenigstens bereichsweise wärmeleitend ausgebildete Druckplatte (i); - Vorspannmittel (13, 14, 19), die ausgelegt sind, die Kontaktierungsmittel (11, 16) gegen das Leistungshalbleiterbauelement (12) zur elektrischen Kontaktierung und das Leistungshalbleiterbauelement (12) gegen den wenigstens einen wärmeleitenden Bereich der wenigstens bereichsweise wärmeleitend ausgebildeten Druckplatte (2), bevorzugt in Richtung des Kühlkörpers (18), zur thermischen Kontaktierung vorzuspannen; - Befestigungsmittel (1, 7, 17) zur Befestigung der Vorspannmittel an dem Kühlkörper (18), wobei die Befestigungsmittel (1, 7, 17) die wenigstens bereichsweise wärmeleitend ausgebildete Druckplatte (1) umfassen, dadurch gekennzeichnet, dass die wenigstens bereichsweise wärmeleitende Druckplatte (1) wenigstens ein den Leistungshalbleiter (12) umgebendes Becken (9) ausbildet.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)