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1. (WO2017031821) CERAMIC RING CAPABLE OF CHANGING SHAPE AND APPEARANCE OF SURFACE THIN FILM OF WAFER

Pub. No.:    WO/2017/031821    International Application No.:    PCT/CN2015/092365
Publication Date: Fri Mar 03 00:59:59 CET 2017 International Filing Date: Thu Oct 22 01:59:59 CEST 2015
IPC: H01L 21/67
Applicants: SHENYANG PIOTECH CO., LTD.
沈阳拓荆科技有限公司
Inventors: LIU, Yijun
刘忆军
YANG, Yan
杨艳
QI, Yanli
戚艳丽
NING, Jianping
宁建平
Title: CERAMIC RING CAPABLE OF CHANGING SHAPE AND APPEARANCE OF SURFACE THIN FILM OF WAFER
Abstract:
A ceramic ring (1) capable of changing the shape and appearance of a surface thin film of a wafer (3) in a semiconductor plasma processing device. The ceramic ring (1) is located on an objective table (5), and is used for bearing a wafer (3) to be machined. An edge, supporting a step (4) of the wafer (3), of the ceramic ring (1) is at a right angle, and the height d1 of the step can be set differently. In a high-temperature process, when a plasma air flow passes through the edge of the step (4), the height d1 of the step exerts an impact on the flowing of the air flow, thereby impacting the uniformity of a film layer. The air flow distribution at the step (4) of the ceramic ring and the edge of the wafer (3) can be effectively adjusted, thereby impacting the uniformity of plasma distribution, and improving the growth condition of an edge thin film of the wafer (3). The ceramic ring is reasonable in structure, is practical and is easy to implement. The ceramic ring can be widely used in the technical field of semiconductor film deposition.