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1. (WO2017031528) EVACUATED CORE CIRCUIT BOARD
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Pub. No.: WO/2017/031528 International Application No.: PCT/AU2016/000297
Publication Date: 02.03.2017 International Filing Date: 26.08.2016
IPC:
F21V 29/00 (2015.01) ,F21V 29/70 (2015.01) ,F21V 29/74 (2015.01) ,F21V 7/00 (2006.01) ,F21V 13/00 (2006.01)
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29
Cooling or heating arrangements
[IPC code unknown for F21V 29/70][IPC code unknown for F21V 29/74]
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
7
Reflectors for light sources
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
13
Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/-F21V11/204
Applicants:
CONTARINO, Aldo [AU/AU]; AU
THIN THERMAL EXCHANGE PTE LTD [SG/SG]; 488 Sims Avenue #02-00 387560 Singapore, SG
Inventors:
CONTARINO, Aldo; AU
FREIBERG, Michael; AU
Agent:
WRAYS; 56 Ord Street West Perth, Western Australia 6005, AU
Priority Data:
201590345726.08.2015AU
Title (EN) EVACUATED CORE CIRCUIT BOARD
(FR) CARTE DE CIRCUIT IMPRIMÉ À NOYAU SOUS VIDE
Abstract:
(EN) An evacuated core circuit board (10) for dissipating heat from a heat generating electronic component, the evacuated core circuit board comprising: at least one circuit layer (12) to which the heat generating electronic component (14) is electronically coupled; a base layer (16) a comprising a body structure (19) having a substantially hollow interior (20); and a dielectric layer (18) provided between at least a portion of the circuit layer (12) and the base layer (16), wherein the hollow interior (20) is at least partially evacuated.
(FR) L'invention concerne une carte de circuit imprimé à noyau sous vide (10) permettant de dissiper la chaleur d'un composant électronique générant de la chaleur, la carte de circuit imprimé à noyau sous vide comprenant : au moins une couche de circuit (12) à laquelle le composant électronique générant de la chaleur (14) est électroniquement couplé; une couche de base (16) comprenant une structure de corps (19) présentant un intérieur sensiblement creux (20); et une couche diélectrique (18) disposée entre au moins une partie de la couche de circuit (12) et la couche de base (16), l'intérieur creux (20) étant au moins partiellement mis sous vide.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)