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1. WO2017025943 - LEAD-FREE THICK FILM RESISTANT COMPOSITION, LEAD-FREE THICK FILM RESISTOR, AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2017/025943
Publication Date 16.02.2017
International Application No. PCT/IB2016/056085
International Filing Date 12.10.2016
IPC
H01B 1/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
14Conductive material dispersed in non-conductive inorganic material
H01B 1/08 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
06mainly consisting of other non-metallic substances
08oxides
CPC
H01B 1/08
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
06mainly consisting of other non-metallic substances
08oxides
H01B 1/14
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
14Conductive material dispersed in non-conductive inorganic material
Applicants
  • 대주전자재료 주식회사 DAE JOO ELECTRONIC MATERIALS CO., LTD. [KR]/[KR]
Inventors
  • 우동준 WOO, Dong Jun
  • 이혜성 LEE, Hye Sung
  • 김경용 KIM, Kyoung Yong
  • 강성학 KANG, Sung Hak
  • 임종찬 LIM, Jong Chan
Agents
  • 특허법인 플러스 PLUS INTERNATIONAL IP LAW FIRM
Priority Data
10-2015-011482113.08.2015KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) LEAD-FREE THICK FILM RESISTANT COMPOSITION, LEAD-FREE THICK FILM RESISTOR, AND METHOD FOR MANUFACTURING SAME
(FR) COMPOSITION RÉSISTANTE DE FILM ÉPAIS SANS PLOMB, RÉSISTANCE EN FILM ÉPAIS SANS PLOMB, ET LEUR PROCÉDÉ DE FABRICATION
(KO) 무연 후막 저항 조성물, 무연 후막 저항체 및 이의 제조방법
Abstract
(EN)
The present invention relates to a lead-free thick film resistant composition, a lead-free thick film resistor, and a method for manufacturing the same. More specifically, the present invention relates to a lead-free thick film resistant composition, which has improved temperature characteristics, current noise, overload characteristics, and antistatic characteristics in a wide resistance range even without a lead component, by forming a double network structure comprising a conductive composite powder containing a ruthenium-based composite oxide and a glass component, to a lead-free thick film resistor, and to a method for manufacturing the same.
(FR)
La présente invention concerne une composition résistante de film épais sans plomb, une résistance en film épais sans plomb, et un procédé de fabrication de ceux-ci. Plus particulièrement, la présente invention se rapporte à une composition résistante de film épais sans plomb, qui a des caractéristiques de température améliorées, un bruit de courant amélioré, des caractéristiques de surcharge améliorées et des caractéristiques antistatiques améliorées dans une large plage de résistance même sans composant à base de plomb, en formant une double structure de réseau comprenant une poudre composite conductrice contenant un oxyde composite à base de ruthénium et un composant de verre. L'invention concerne également une résistance en film épais sans plomb, et un procédé de fabrication de ceux-ci.
(KO)
본 발명은 무연 후막 저항 조성물, 무연 후막 저항체 및 이의 제조방법에 관한 것이다. 보다 상세하게는 루테늄계 복합 산화물 및 유리성분을 포함하는 전도성 복합분말을 포함하여 이중네트워크 구조를 형성함으로써, 납 성분이 없이도 폭 넓은 저항 범위에서 온도특성, 전류잡음, 과부하 특성 및 정전기 방지 특성이 향상된 무연 후막 저항 조성물, 무연 후막 저항체 및 이의 제조방법에 관한 것이다.
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