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1. (WO2017022721) EPOXY RESIN COMPOSITION, FILM-SHAPED EPOXY RESIN COMPOSITION, AND ELECTRONIC DEVICE

Pub. No.:    WO/2017/022721    International Application No.:    PCT/JP2016/072537
Publication Date: Fri Feb 10 00:59:59 CET 2017 International Filing Date: Tue Aug 02 01:59:59 CEST 2016
IPC: C08G 59/62
C08K 3/00
C08L 63/00
C08L 83/04
H01L 23/29
H01L 23/31
Applicants: HITACHI CHEMICAL COMPANY, LTD.
日立化成株式会社
Inventors: OGIHARA Hirokuni
荻原 弘邦
NOMURA Yutaka
野村 豊
WATASE Yusuke
渡瀬 裕介
SUZUKI Masahiko
鈴木 雅彦
TOBA Masaya
鳥羽 正也
FUJIMOTO Daisuke
藤本 大輔
KANEKO Tomoyo
金子 知世
Title: EPOXY RESIN COMPOSITION, FILM-SHAPED EPOXY RESIN COMPOSITION, AND ELECTRONIC DEVICE
Abstract:
The present invention relates to an epoxy resin composition containing an epoxy resin (A), a resin (B) having an aromatic ring and a hydroxyl group, silicone powder (C), a curing accelerator (D), and an inorganic filler (E), the epoxy resin (A) including an epoxy resin which is liquid at 25°C, the resin (B) having an aromatic ring and a hydroxyl group including a resin having a naphthalene ring and a hydroxyl group, the content of the epoxy resin which is liquid at 25°C being 32% by mass on the basis of the total quantity of the epoxy resin (A) and the resin (B) having an aromatic ring and a hydroxyl group, and the content of the silicone powder (C) being 0.80-7.30% by mass on the basis of the total quantity of the epoxy resin composition (excluding the solvent in a case in which the epoxy resin composition contains a solvent).