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1. (WO2017022098) COMPONENT MOUNTING APPARATUS

Pub. No.:    WO/2017/022098    International Application No.:    PCT/JP2015/072235
Publication Date: Fri Feb 10 00:59:59 CET 2017 International Filing Date: Thu Aug 06 01:59:59 CEST 2015
IPC: H05K 13/02
H05K 13/04
Applicants: FUJI MACHINE MFG. CO., LTD.
富士機械製造株式会社
Inventors: IISAKA Jun
飯阪 淳
ITO Hidetoshi
伊藤 秀俊
TANAKA Keita
田中 啓太
Title: COMPONENT MOUNTING APPARATUS
Abstract:
A component mounting apparatus (1) of the present invention is provided with: a component supply unit (3) having a feeder device (31) that sequentially supplies components (P) to a supply position (34) by feeding a carrier tape (9) having cavities (93) formed therein; and a component placing device (4) having a mounting head (44), a head drive mechanism (49), and a suction nozzle (46), which sucks a component from a cavity at the supply position and mounts the component on a substrate (K). The component mounting apparatus is also provided with: a component fewness detection unit (camera device 7) that detects that the number of the remaining components held by the carrier tape is reduced to a predetermined small number; and an ineffective suction avoiding unit (control device 6) that avoids, on the basis of detection results obtained from the component fewness detection unit, ineffective suction operations of the section nozzle when the number of the remaining components held by the carrier tape becomes zero. With the present invention, substrate production efficiency can be improved by eliminating the ineffective suction operations with respect to the cavities not holding the components.