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1. (WO2017022068) ASSEMBLY STRUCTURE FOR HOUSING OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

Pub. No.:    WO/2017/022068    International Application No.:    PCT/JP2015/072038
Publication Date: Fri Feb 10 00:59:59 CET 2017 International Filing Date: Wed Aug 05 01:59:59 CEST 2015
IPC: H05K 5/02
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: MORIHARA, Takafumi
森原 崇文
YAMAMOTO, Satoru
山本 知
Title: ASSEMBLY STRUCTURE FOR HOUSING OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Abstract:
An opening (30) is provided in a top plate (3). An opening (20) is provided in a side plate (2) substantially orthogonal to the top plate (3). A wall (22), which extends from a portion of the edge of the opening (20), and sinks towards the inside of a housing (5), has an inclined surface (22b) which is radially inclined from the inside of the housing (5) towards the edge of the opening (20), and which is oriented towards opening (30) and opening (20).