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1. (WO2017020622) HEAT DISSIPATION SUBSTRATE AND SEAL TYPE PTC THERMISTOR HEATER

Pub. No.:    WO/2017/020622    International Application No.:    PCT/CN2016/081996
Publication Date: Fri Feb 10 00:59:59 CET 2017 International Filing Date: Sat May 14 01:59:59 CEST 2016
IPC: H05B 3/02
H05B 3/04
H05B 3/00
Applicants: SHENZHEN SHANYUAN ELECTRONIC CORPORATION
深圳山源电器股份有限公司
Inventors: ZHANG, Xiang
张翔
ZHANG, Guangquan
张广全
Title: HEAT DISSIPATION SUBSTRATE AND SEAL TYPE PTC THERMISTOR HEATER
Abstract:
A heat dissipation substrate and a seal type PTC (Positive Temperature Coefficient) thermistor heater are disclosed in the present invention, wherein the heat dissipation substrate comprises a cavity body with an accommodating cavity, several heat dissipation fins are respectively fixed on the outside surfaces of the top and bottom of the cavity body, the upper and lower portions of the left inner wall of the cavity body are respectively provided with a first locating rib, the upper and lower portions of the right inner wall of the cavity body are respectively provided with a second locating rib, the left inner surface of the accommodating cavity between two first locating ribs is an arc surface protruding outward, the right inner surface of the accommodating cavity between two first locating ribs is also an arc surface protruding outward, the left and right outer walls of the cavity body are both groove shape structure, the spaces between two first locating ribs and between two second locating ribs are less than the thickness of the PTC heating component, the spaces between the first locating rib and the second locating rib located on both the upper part and the lower part are less than the length of the heat dissipation fins. The heat dissipation substrate disclosed by the invention can work for a long time and is free from electrical potential safety hazards.