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1. (WO2017020535) COPPER/ALUMINIUM ALLOY CRYSTAL OSCILLATION PLATE COATING PROCESS

Pub. No.:    WO/2017/020535    International Application No.:    PCT/CN2016/000422
Publication Date: Fri Feb 10 00:59:59 CET 2017 International Filing Date: Tue Aug 02 01:59:59 CEST 2016
IPC: C23C 14/35
C23C 14/18
Applicants: ZHONGSHAN TAI WEI ELECTRONIC CO., LTD.
中山泰维电子有限公司
Inventors: XIAO, Gonghe
肖共和
CHEN, Yuanqin
陈愿勤
Title: COPPER/ALUMINIUM ALLOY CRYSTAL OSCILLATION PLATE COATING PROCESS
Abstract:
A copper/aluminium alloy crystal oscillation plate alloy coating process. Magnetron sputtering technology is used to form an aluminium film and a copper film on a quartz substrate. A copper/aluminium alloy film formed on the quartz plate in the process is firmly combined with the quartz plate, and the compositional proportions of the copper and aluminium in the copper/aluminium alloy film can be accurately controlled.