Provided is a method for mechanically preparing a via hole on a printed circuit board, comprising a drilling step, a metallic nail striking step, a line laminating step and a welding step. Further provided is a printed circuit board with a mechanically prepared via hole, comprising a substrate. Via holes are drilled at intersections on each layer of the substrate where conductive wires need to be in communication with each other, metallic nails are struck into the via holes, a conductive wire layer is laminated on the substrate, and the metallic nails are welded to the conductive wire layer in welding areas at two ends of each via hole. Compared with the existing electroless copper method, striking a copper nail into a via hole on the substrate in a mechanical way can completely ensure an even copper plating of the wall of the hole, such that lines of the printed circuit board are stably and reliably connected. Compared with the existing electroless copper method, the method for mechanically preparing a via hole on a printed circuit board has a simpler process, and is more environmentally friendly for not using chemical agents.