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1. (WO2017019738) SOFT AND/OR FLEXIBLE EMI SHIELDS AND RELATED METHODS
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/019738 International Application No.: PCT/US2016/044203
Publication Date: 02.02.2017 International Filing Date: 27.07.2016
IPC:
H05K 9/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
Applicants:
LAIRD TECHNOLOGIES, INC. [US/US]; 3481 Rider Trail South Earth City, Missouri 63045, US
Inventors:
SONG, John; US
ENGLISH, Gerald R.; US
KHORRAMI, Mohammadali; US
DIXON, Paul Francis; US
Agent:
FUSSNER, Anthony G.; US
Priority Data:
62/199,08730.07.2015US
62/326,93325.04.2016US
Title (EN) SOFT AND/OR FLEXIBLE EMI SHIELDS AND RELATED METHODS
(FR) BLINDAGES CONTRE LES INTERFÉRENCES ÉLECTROMAGNÉTIQUES ET PROCÉDÉS ASSOCIÉS
Abstract:
(EN) According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).
(FR) Divers modes de réalisation de l'invention cités à titre d'exemple concernent des blindages souples et/ou flexibles contre les interférences électromagnétiques (EMI). Un mode de réalisation donné à titre d'exemple comprend un blindage apte à être utilisé pour assurer la protection contre les interférences électromagnétiques pour un ou plusieurs composants sur un substrat. Le blindage comprend généralement un ou plusieurs contact(s) configuré(s) pour l'installation sur le substrat et un couvercle électroconducteur configuré pour l'installation sur le(s) contact(s).
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)