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1. (WO2017018999) THERMAL RADIATION HEAT DISSIPATION STRUCTURE

Pub. No.:    WO/2017/018999    International Application No.:    PCT/US2015/042069
Publication Date: Fri Feb 03 00:59:59 CET 2017 International Filing Date: Sat Jul 25 01:59:59 CEST 2015
IPC: H05K 7/20
H01L 23/34
Applicants: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventors: CHANG, Chi-Hao
WU, Kuan-Ting
LIN, Chien-Ting
Title: THERMAL RADIATION HEAT DISSIPATION STRUCTURE
Abstract:
In one example, a thermal radiation heat dissipation structure for dissipating heat from an electronic device is described. The thermal radiation heat dissipation structure includes a metal substrate of the electronic device. Further, the thermal radiation heat dissipation structure includes a thermal radiation derived powder coating that is disposed on the metal substrate of the electronic device for dissipating heat from the electronic device via thermal radiation, wherein the thermal radiation derived powder coating comprises a resin and thermal radiation materials and wherein the thermal radiation materials include grapheme, and carbon nanotube.