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1. (WO2017018596) PLANAR LIGHTWAVE CIRCUIT-BASED INTEGRATED OPTICAL CHIP
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/018596 International Application No.: PCT/KR2015/010527
Publication Date: 02.02.2017 International Filing Date: 06.10.2015
IPC:
G02B 6/12 (2006.01) ,H01S 3/11 (2006.01)
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10
of the optical waveguide type
12
of the integrated circuit kind
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
3
Lasers, i.e. devices for generation, amplification, modulation, demodulation, or frequency-changing, using stimulated emission, of infra-red, visible, or ultra-violet waves
10
Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
11
in which the quality factor of the optical resonator is rapidly changed, i.e. giant-pulse technique
Applicants: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY[KR/KR]; (Guseong-dong) 291 Daehak-ro Yuseong-gu Daejeon 34141, KR
Inventors: KIM, Jung Won; KR
KIM, Chur; KR
Agent: MUHANN PATENT & LAW FIRM; (Myeonglim Building, Nonhyeon-dong) 5th Floor, 9 Hakdong-ro 3-gil Gangnam-gu Seoul 06044, KR
Priority Data:
10-2015-010508124.07.2015KR
10-2015-013657725.09.2015KR
Title (EN) PLANAR LIGHTWAVE CIRCUIT-BASED INTEGRATED OPTICAL CHIP
(FR) PUCE OPTIQUE INTÉGRÉE À BASE DE CIRCUIT OPTIQUE PLANAIRE
(KO) 평면형 광파 회로 기반의 집적 광학 칩
Abstract:
(EN) In an embodiment, an integrated optical chip comprises: a substrate; a plurality of planar lightwave circuit-based optical components that are formed on one surface of the substrate; and a plurality of optical waveguides that are formed on the one surface of the substrate and that connect the plurality of optical components to one another. In the embodiment, the plurality of optical components include a saturable absorber having nonlinear loss characteristics. The saturable absorber may comprise: a core layer that is formed on the one surface of the substrate; an overcladding layer that wraps around at least a part of the core layer; and a saturable absorption layer that is formed on at least a part of the overcladding layer and that is arranged so as to interact with an evanescent field of light guided through at least a part of the core layer.
(FR) L'invention concerne, dans un mode de réalisation, une puce optique intégrée comprenant : un substrat ; une pluralité de composants optiques à base de circuit optique planaire qui sont formés sur une surface du substrat ; et une pluralité de guides d'ondes optiques qui sont formés sur la surface du substrat et qui connectent la pluralité de composants optiques les uns aux autres. Dans le mode de réalisation, la pluralité de composants optiques comprennent un absorbeur saturable ayant des caractéristiques de perte non linéaires. L'absorbeur saturable peut comprendre : une couche d'âme qui est formée sur la surface du substrat ; une couche de surgainage qui s'enveloppe autour d'au moins une partie de la couche d'âme ; et une couche d'absorption saturable qui est formée sur au moins une partie de la couche de surgainage et qui est agencée de manière à interagir avec un champ évanescent de la lumière guidée à travers au moins une partie de la couche d'âme.
(KO) 일실시예에서, 집적 광학 칩은 기판, 상기 기판의 일면 상에 형성된 평면형 광파 회로 기반의 복수의 광학 컴포넌트, 및 상기 기판의 상기 일면 상에 형성되고, 상기 복수의 광학 컴포넌트를 서로 연결하는 복수의 광도파로를 포함한다. 일실시예에서, 상기 복수의 광학 컴포넌트는 비선형 손실 특성을 가지는 포화 흡수체를 포함한다. 상기 포화 흡수체는, 상기 기판의 상기 일면 상에 형성되는 코어층, 상기 코어층의 적어도 일부를 감싸는 오버클래딩층, 및 상기 오버클래딩층의 적어도 일부 상에 형성되고 상기 코어층의 적어도 일부를 도파하는 광의 감쇠장과 상호 작용하도록 배치되는 포화 흡수층을 포함할 수 있다.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Korean (KO)
Filing Language: Korean (KO)