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1. (WO2017018487) COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICES, THIN COPPER ALLOY SHEET FOR ELECTRONIC/ELECTRIC DEVICES, AND CONDUCTIVE PART AND TERMINAL FOR ELECTRONIC/ELECTRIC DEVICES

Pub. No.:    WO/2017/018487    International Application No.:    PCT/JP2016/072195
Publication Date: Fri Feb 03 00:59:59 CET 2017 International Filing Date: Fri Jul 29 01:59:59 CEST 2016
IPC: C22C 9/04
H01B 1/02
H01B 5/02
Applicants: MITSUBISHI MATERIALS CORPORATION
三菱マテリアル株式会社
MITSUBISHI SHINDOH CO., LTD.
三菱伸銅株式会社
Inventors: MAKI Kazunari
牧 一誠
MORI Hiroyuki
森 広行
NAKASATO Yosuke
中里 洋介
YAMASHITA Daiki
山下 大樹
Title: COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICES, THIN COPPER ALLOY SHEET FOR ELECTRONIC/ELECTRIC DEVICES, AND CONDUCTIVE PART AND TERMINAL FOR ELECTRONIC/ELECTRIC DEVICES
Abstract:
The present copper alloy for electronic/electric devices contains greater than 2 mass% to 36.5 mass% Zn, 0.1 mass% to 0.9 mass% Sn, 0.15 mass% to less than 1.0 mass% Ni, 0.005 mass% to 0.1 mass% P, and 0.001 mass% to 0.1 mass% Fe, the balance being obtained from Cu and unavoidable impurities, and in atom ratios, satisfies 3 < (Ni+Fe)/P < 30, 0.3 < Sn/(Ni+Fe) < 2.7, and 0.002 ≤ [Fe/Ni] < 0.6, and satisfies the atom ratio [Fe/Ni]P of the Fe content to the Ni content in a [Ni, Fe]-P-based deposit containing Fe, Ni and P with respect to the atom ratio [Fe/Ni] of the Fe content to Ni content in the alloy as a whole being 5 ≤ [Fe/Ni]P/[Fe/Ni] ≤ 200.