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1. (WO2017018270) ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP OR SEMICONDUCTOR COMPONENT USING SAME

Pub. No.:    WO/2017/018270    International Application No.:    PCT/JP2016/071136
Publication Date: Fri Feb 03 00:59:59 CET 2017 International Filing Date: Wed Jul 20 01:59:59 CEST 2016
IPC: C09J 7/02
C09J 4/02
C09J 11/06
C09J 133/06
H01L 21/301
Applicants: DENKA COMPANY LIMITED
デンカ株式会社
Inventors: SHIBAYAMA, Takenori
柴山 雄紀
TANAKA, Tomoaki
田中 智章
Title: ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR CHIP OR SEMICONDUCTOR COMPONENT USING SAME
Abstract:
Provided are: an adhesive sheet for semiconductor processing, which is capable of suppressing chipping and chip scattering during a dicing step, and which is not susceptible to leaving adhesive residue; and a method for producing a semiconductor chip or a semiconductor component, which uses this adhesive sheet for semiconductor processing. The present invention is capable of providing an adhesive tape for semiconductor processing, which comprises an adhesive layer on a base film, and which is configured such that: an adhesive constituting the adhesive layer contains 100 parts by mass of a (meth)acrylic acid ester polymer; a photopolymerizable compound is composed of a specific component; 2-20% by mass of the (meth)acrylic acid ester polymer is composed of a monomer having a carboxyl group; the (meth)acrylic acid ester polymer has a weight average molecular weight of from 100,000 to 700,000; the photopolymerizable compound has one or more specific acryloyl groups and one or more specific methacryloyl groups, with the total of the acryloyl groups and methacryloyl groups being 4-8; and the photopolymerizable compound has a weight average molecular weight of from 1,000-5,000. Consequently, this adhesive tape for semiconductor processing ameliorates chip scattering or the like during a dicing step. The present invention is also capable of providing a method for producing a semiconductor chip or a semiconductor component, which uses this adhesive tape for semiconductor processing.