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1. (WO2017018232) ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/018232 International Application No.: PCT/JP2016/070876
Publication Date: 02.02.2017 International Filing Date: 14.07.2016
IPC:
C23C 26/00 (2006.01) ,B32B 15/20 (2006.01) ,C25D 1/04 (2006.01) ,H05K 1/09 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
26
Coating not provided for in groups C23C2/-C23C24/87
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
20
comprising aluminium or copper
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1
Electroforming
04
Wires; Strips; Foils
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
Applicants:
三井金属鉱業株式会社 MITSUI MINING & SMELTING CO., LTD. [JP/JP]; 東京都品川区大崎一丁目11番1号 1-11-1 Osaki, Shinagawa-Ku, Tokyo 1418584, JP
Inventors:
津吉 裕昭 TSUYOSHI Hiroaki; JP
立岡 歩 TATEOKA Ayumu; JP
細川 眞 HOSOKAWA Makoto; JP
Agent:
高村 雅晴 TAKAMURA Masaharu; JP
Priority Data:
2015-14971729.07.2015JP
Title (EN) ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
(FR) FEUILLE DE CUIVRE RUGOSIFIÉE, STRATIFIÉ PLAQUÉ CUIVRE ET CARTE DE CONNEXION IMPRIMÉE
(JA) 粗化処理銅箔、銅張積層板及びプリント配線板
Abstract:
(EN) Provided is a roughened copper foil that has good adhesiveness to resin as well as good abrasion resistance in spite of fine projections and recesses thereof having a low roughness suitable for fine-pitch circuit formation and high-frequency applications, and therefore stably exhibits good adhesiveness to resin even after rubbing against something during processing of a copper-clad foil or production of a printed wiring board. The roughened copper foil according to the present invention has a roughened surface having fine projections and recesses comprising acicular crystals and/or tabular crystals on at least one side thereof. The roughened surface has a maximum height Sz, as measured in accordance with ISO25178, of not more than 1.5 µm and an arithmetic mean peak curvature Spc, as measured in accordance with ISO25178, of not more than 1300 mm-1.
(FR) L'invention concerne une feuille de cuivre rugosifiée qui présente une bonne adhésivité à la résine ainsi qu'une bonne résistance à l'abrasion en dépit des fines parties saillantes et en creux qu'elle contient. Ladite feuille a une rugosité faible, appropriée pour la formation de circuits à pas fin et d'applications haute fréquence; en conséquence elle présente de façon stable une bonne adhésivité à la résine même après avoir subi des frottements pendant le traitement d'une feuille plaquée cuivre ou la production d'une carte de connexion imprimée. La feuille de cuivre rugosifiée selon la présente invention a une surface rugosifiée pourvue de fines parties saillantes et en creux comprenant des cristaux aciculaires et/ou des cristaux tabulaires sur au moins un de ses côtés. La surface rugosifiée a une hauteur maximale Sz, telle que mesurée selon l'ISO-25178, ne dépassant pas 1,5 µm et un courbure moyenne arithmétique des pics Spc, telle que mesurée selon l'ISO-25178, ne dépassant pas 1300 mm-1.
(JA) ファインピッチ回路形成や高周波用途に適した低粗度の微細凹凸でありながらも、樹脂との密着性のみならず耐擦れ性にも優れ、それ故、銅張積層板の加工ないしプリント配線板の製造において何らかの物に擦れた後においても、樹脂との優れた密着性を安定して発揮することが可能な粗化処理銅箔が提供される。本発明の粗化処理銅箔は、針状結晶及び/又は板状結晶で構成される微細凹凸を備えた粗化処理面を少なくとも一方の側に有する。粗化処理面は、ISO25178に準拠して測定される最大高さSzが1.5μm以下であり、かつ、ISO25178に準拠して測定される山頂点の算術平均曲Spcが1300mm-1以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)