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1. (WO2017018078) SPUTTERING DEVICE AND INSULATING FILM PRODUCTION METHOD

Pub. No.:    WO/2017/018078    International Application No.:    PCT/JP2016/067471
Publication Date: Fri Feb 03 00:59:59 CET 2017 International Filing Date: Wed Jun 08 01:59:59 CEST 2016
IPC: C23C 14/34
C23C 14/08
H01L 21/31
H01L 21/316
Applicants: YOUTEC CO., LTD.
株式会社ユーテック
Inventors: HONDA, Yuuji
本多 祐二
KIJIMA, Takeshi
木島 健
NOMURA, Takeshi
野村 岳
Title: SPUTTERING DEVICE AND INSULATING FILM PRODUCTION METHOD
Abstract:
The present invention addresses the problem of improving the film formation rate of a sputtering device provided with a sputtering target including an insulator. One aspect of the present invention is a sputtering device provided with: a holding part 13 for holding a substrate 12; a sputtering target 14 including an insulator having a specific resistance of 1×107 Ω∙cm or more; an output supply mechanism 16 for supplying high-frequency output of 10 kHz to 30 MHz, inclusive, to the sputtering target in a pulse form having a DUTY ratio of 25-90%, inclusive, in a cycle of 1/20-1/3 ms, inclusive; a first gas introduction source 17 for introducing a noble gas into a chamber 11; and a vacuum exhaust mechanism 19 for evacuating the chamber, wherein the DUTY ratio is the ratio of the period in which the high-frequency output is applied to the sputtering target in one cycle.