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1. (WO2017017837) MOLD DEVICE

Pub. No.:    WO/2017/017837    International Application No.:    PCT/JP2015/071640
Publication Date: Fri Feb 03 00:59:59 CET 2017 International Filing Date: Fri Jul 31 01:59:59 CEST 2015
IPC: H01L 23/48
B29C 33/12
H01L 21/56
Applicants: MITSUBISHI ELECTRIC CORPORATION
三菱電機株式会社
Inventors: YASUI Takatoshi
安井 貴俊
HATA Yuki
秦 佑貴
SAITO Shoji
斉藤 省二
ANDO Katsuji
安東 勝治
OKAMOTO Korehide
岡本 是英
MURAI Ryoji
村井 亮司
Title: MOLD DEVICE
Abstract:
The purpose of the present invention is to provide a mold device having a simple structure that has suppressed the entry of resin between an insert electrode and a nut when resin-sealing a semiconductor device. The present invention is a mold device for resin-sealing a semiconductor device provided with an insert electrode 102. In the semiconductor device, an insert hole 102a is provided to the insert electrode 102, a nut 103 having a screw hole 103a is disposed on the insert electrode 102 such that the insert hole 102a and the screw hole 103a are linked. The mold device is provided with: a mold body 104 into which a resin is injected and resin-seals the semiconductor device including a side of the electrode 102 in which the nut 103 is disposed; and a rod-shaped member that is inserted into the insert hole 102a. The rod-shaped member is inserted into the screw hole 103a of the nut 103 through the insert hole 102a of the insert electrode 102, and pulls the nut 103 to the side of the insert electrode 102.