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1. (WO2017016997) PROCESS FOR ETCHING HARD MATERIALS
Latest bibliographic data on file with the International Bureau    Submit observation

Pub. No.: WO/2017/016997 International Application No.: PCT/EP2016/067492
Publication Date: 02.02.2017 International Filing Date: 22.07.2016
IPC:
B81C 1/00 (2006.01) ,H01L 21/033 (2006.01) ,H01L 41/332 (2013.01)
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
C
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
1
Manufacture or treatment of devices or systems in or on a substrate
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
027
Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
033
comprising inorganic layers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
41
Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
22
Processes or apparatus specially adapted for the assembly, manufacture or treatment of piezo-electric or electrostrictive devices or of parts thereof
33
Shaping or machining of piezo-electric or electrostrictive bodies
332
by etching, e.g. lithography
Applicants: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES[FR/FR]; Bat le Ponant 25 rue Leblanc 75015 Paris, FR
ARNANO[FR/FR]; 7 Parvis Louis Néel BP50 38000 Grenoble Cedex 9, FR
Inventors: SALVETAT, Thierry; FR
AUBERT, Jean-Jacques; FR
REY, Alain-Marcel; FR
Agent: BREVALEX; 95 rue d'Amsterdam 75378 Paris Cedex 8, FR
Priority Data:
15 5705924.07.2015FR
Title (EN) PROCESS FOR ETCHING HARD MATERIALS
(FR) PROCEDE DE GRAVURE DE MATERIAUX DURS
Abstract:
(EN) Process for etching at least one layer of hard material (100), including at least implementing the following steps: direct bonding, to the layer of material, a metal and/or semiconductor first hard mask (105), the first hard mask being passed through by at least one first aperture (114) that opens onto the layer of material and that corresponds to a pattern intended to be etched in the layer of material; and etching at least one section of the layer of material level with the first aperture by implementing at least one ion etch in an ICP system and/or implementing at least one implantation of ions into the section of the layer of material and at least one chemical etch of the section of the layer of material having undergone the implantation of ions.
(FR) Procédé de gravure d'au moins une couche de matériau dur (100), comportant au moins la mise en œuvre des étapes suivantes : - collage direct, sur la couche de matériau, d'un premier masque dur (105) métallique et/ou en semi-conducteur, le premier masque dur étant traversé par au moins une première ouverture (114) débouchant sur la couche de matériau et correspondant à un motif destiné à être gravé dans la couche de matériau; - gravure d'au moins une portion de la couche de matériau au niveau de la première ouverture par la mise en œuvre d'au moins une gravure ionique dans un système ICP, et/ou par la mise en œuvre d'au moins une implantation ionique dans la portion de la couche de matériau et d'au moins une gravure chimique de la portion de la couche de matériau ayant subie l'implantation ionique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: French (FR)
Filing Language: French (FR)