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1. (WO2017016725) ELECTRONIC MODULE WITH A COMPONENT WHICH CAN BE FLEXIBLY PLACED BY MEANS OF A SOCKET ELEMENT, AND METHOD FOR PRODUCING SAME

Pub. No.:    WO/2017/016725    International Application No.:    PCT/EP2016/062802
Publication Date: Fri Feb 03 00:59:59 CET 2017 International Filing Date: Tue Jun 07 01:59:59 CEST 2016
IPC: H05K 3/32
H05K 3/28
H05K 3/30
H05K 5/00
Applicants: ROBERT BOSCH GMBH
Inventors: LISKOW, Uwe
Title: ELECTRONIC MODULE WITH A COMPONENT WHICH CAN BE FLEXIBLY PLACED BY MEANS OF A SOCKET ELEMENT, AND METHOD FOR PRODUCING SAME
Abstract:
The invention relates to an electronic module (1) and a method for producing same. The electronic module has a circuit board (3), at least one first component (5), and a socket element (7) which has a first surface (6) and a second surface (8) opposite the first surface and the first surface (6) of which lies on a surface of the circuit board (3) and is fixed to the circuit board. The electronic module has a second component (9) which is secured to the socket element (7) and is electrically connected to the circuit board (3) via the socket element. Furthermore, a protective compound (11) is provided which is arranged on the surface of the circuit board (3) and encapsulates the first component (5). The electronic module (1) is characterized in that the socket element (7) is partly embedded into the protective compound (11) such that lateral flanks (10) of the socket element (7) are covered by the protective compound (11), and the second surface (8) of the socket element (7) protrudes out of the protective compound (11) in an exposed manner. Connection elements (19) of the socket element (7) and connections (17) of the second component (9) can be connected preferably via a welding connection (17) and can be encapsulated by a protective compound (21) or a cover. Second components (9), such as sensors or plugs for example, can thereby be attached to the circuit board (3) in a mechanically secured and electrically reliable manner. Because standard components and standard assembly methods can be used, changes to the design of the electronic module can be implemented easily and quickly.