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1. WO2017016390 - THYRISTOR ASSEMBLY RADIATOR FOR DC CONVERTER VALVE

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Publication Number WO/2017/016390
Publication Date 02.02.2017
International Application No. PCT/CN2016/089942
International Filing Date 13.07.2016
IPC
H01L 23/473 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 23/367 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367Cooling facilitated by shape of device
H03K 17/72 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
KPULSE TECHNIQUE
17Electronic switching or gating, i.e. not by contact-making and -breaking
51characterised by the use of specified components
56by the use, as active elements, of semiconductor devices
72Bipolar semiconductor devices with more than two PN junctions, e.g. thyristors, programmable unijunction transistors, or with more than three electrodes, e.g. silicon controlled switches, or with more than one electrode connected to the same conductivity region, e.g. unijunction transistors
CPC
H01C 1/08
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
CRESISTORS
1Details
08Cooling, heating or ventilating arrangements
H01L 23/367
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
H01L 23/473
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 25/117
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
10the devices having separate containers
11the devices being of a type provided for in group H01L29/00
117Stacked arrangements of devices
H01L 27/1027
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
10including a plurality of individual components in a repetitive configuration
102including bipolar components
1027Thyristors
H03K 17/72
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
KPULSE TECHNIQUE
17Electronic switching or gating, i.e. not by contact-making and –breaking
51characterised by the components used
56by the use, as active elements, of semiconductor devices
72having more than two PN junctions; having more than three electrodes; having more than one electrode connected to the same conductivity region
Applicants
  • 南京南瑞继保电气有限公司 NR ELECTRIC CO., LTD [CN]/[CN]
  • 南京南瑞继保工程技术有限公司 NR ENGINEERING CO., LTD [CN]/[CN]
  • 常州博瑞电力自动化设备有限公司 NR ELECTRIC POWER ELECTRONICS CO., LTD. [CN]/[CN]
Inventors
  • 张翔 ZHANG, Xiang
  • 方太勋 FANG, Taixun
  • 曹冬明 CAO, Dongming
  • 陈赤汉 CHEN, Chihan
  • 张广泰 ZHANG, Guangtai
  • 刘海彬 LIU, Haibin
Agents
  • 南京经纬专利商标代理有限公司 NANJING JINGWEI PATENT & TRADEMARK AGENCY CO., LTD
Priority Data
201510452042.328.07.2015CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) THYRISTOR ASSEMBLY RADIATOR FOR DC CONVERTER VALVE
(FR) RADIATEUR D’ENSEMBLES DE THYRISTORS POUR VANNE À CONVERTISSEUR DE CC
(ZH) 用于直流换流阀的晶闸管组件散热器
front page image
Abstract
(EN)
A thyristor assembly radiator for a DC converter valve. A water discharging port of an Nth radiator is communicated with a water discharging port of an (N-2)th radiator. A water feeding port of the Nth radiator is communicated with a water feeding port of an (N+2)th radiator. Or, the water feeding port of the Nth radiator is communicated with a water feeding port of the (N-2)th radiator, and the water discharging port of the Nth radiator is communicated with a water discharging port of the (N+2)th radiator. A water discharging port of an Mth radiator is communicated with a water discharging port of an (M-2)th radiator, and a water feeding port of the Mth radiator is communicated with a water feeding port of an (M+2)th radiator. Or, the water feeding port of the Mth radiator is communicated with a water feeding port of the (M-2)th radiator, and the water discharging port of the Mth radiator is communicated with a water discharging port of the (M+2)th radiator. Water feeding ports of the last two radiators are communicated. According to the radiator, the number of joints of a cooling system is reduced, the risk of leakage is lowered, the operation reliability of a converter valve is improved, the maintenance difficulty is lowered, and the maintenance time is shortened.
(FR)
L’invention concerne un radiateur d’ensembles de thyristors pour une vanne à convertisseur de CC. Un port de décharge d’eau d’un Ne radiateur est mis en communication avec un port de décharge d’eau d’un (N−2)e radiateur. Un port d’alimentation en eau du Ne radiateur est mis en communication avec un port d’alimentation en eau d’un (N+2)e radiateur. Ou le port d’alimentation en eau du Ne radiateur est mis en communication avec un port d’alimentation en eau du (N−2)e radiateur, et le port de décharge d’eau du Ne radiateur est mis en communication avec le port de décharge d’eau du (N+2)e radiateur. Un port de décharge d’eau d’un Me radiateur est mis en communication avec un port de décharge d’eau d’un (M−2)e radiateur, et un port d’alimentation en eau du Me radiateur est mis en communication avec un port d’alimentation en eau du (M+2)e radiateur. Ou le port d’alimentation en eau du Me radiateur est mis en communication avec un port d’alimentation en eau du (M−2)e radiateur, et le port de décharge d’eau du Me radiateur est mis en communication avec le port de décharge d’eau du (M+2)e radiateur. Des ports d’alimentation en eau des deux derniers radiateurs sont mis en communication. Selon le radiateur, le nombre de jonctions d’un système de refroidissement est réduit, le risque de fuite est abaissé, la fiabilité de fonctionnement d’une vanne de convertisseur est améliorée, la difficulté de maintenance est abaissée, et le temps de maintenance est réduit.
(ZH)
一种用于直流换流阀的晶闸管组件散热器，第N个散热器的下水口与第N-2个散热器的下水口连通，第N个散热器的上水口与第N+2个散热器的上水口连通，或者第N个散热器的上水口与第N-2个散热器的上水口连通，第N个散热器的下水口与第N+2个散热器的下水口连通；第M个散热器的下水口与第M-2个散热器的下水口连通，第M个散热器的上水口与第M+2个散热器的上水口连通，或者第M个散热器的上水口与第M-2个散热器的上水口连通，第M个散热器的下水口与第M+2个散热器的下水口连通；最后两个散热器的上水口相连通。该散热器减少了冷却系统接头，降低了泄漏风险，提高了换流阀运行可靠性，降低了检修难度、减少检修时间。
Also published as
CN105070697
AU2016300491
KR1020180027592
EP3316293
RU0002660293
US20180218965
BR112018001502
JP2018525847
IN201817001990
CA2992842
MX2018001178
Latest bibliographic data on file with the International Bureau
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