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1. (WO2017006606) LASER PROCESSING MACHINE, LASER PROCESSING METHOD, BOARD MATERIAL PROCESSING SYSTEM, AND BOARD MATERIAL PROCESSING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2017/006606 International Application No.: PCT/JP2016/061877
Publication Date: 12.01.2017 International Filing Date: 13.04.2016
IPC:
B23K 26/10 (2006.01) ,B21D 43/10 (2006.01) ,B23P 23/00 (2006.01) ,B30B 13/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
08
Devices involving relative movement between laser beam and workpiece
10
using a fixed support
B PERFORMING OPERATIONS; TRANSPORTING
21
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
D
WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING
43
Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
02
Advancing work in relation to the stroke of the die or tool
04
by means in mechanical engagement with the work
10
by grippers
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
P
OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
23
Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
B PERFORMING OPERATIONS; TRANSPORTING
30
PRESSES
B
PRESSES IN GENERAL; PRESSES NOT OTHERWISE PROVIDED FOR
13
Methods of pressing not special to the use of presses of any one of the preceding main groups B30B1/-B30B12/146
Applicants:
村田機械株式会社 MURATA MACHINERY, LTD. [JP/JP]; 京都府京都市南区吉祥院南落合町3番地 3, Minami Ochiai-cho, Kisshoin, Minami-ku, Kyoto-shi, Kyoto 6018326, JP
Inventors:
尾関 浩二 OZEKI, Koji; JP
Agent:
西 和哉 NISHI, Kazuya; JP
Priority Data:
2015-13428003.07.2015JP
Title (EN) LASER PROCESSING MACHINE, LASER PROCESSING METHOD, BOARD MATERIAL PROCESSING SYSTEM, AND BOARD MATERIAL PROCESSING METHOD
(FR) MACHINE DE TRAITEMENT AU LASER, PROCÉDÉ DE TRAITEMENT AU LASER, SYSTÈME DE TRAITEMENT DE MATÉRIAU DE TYPE CARTE, ET PROCÉDÉ DE TRAITEMENT DE MATÉRIAU DE TYPE CARTE
(JA) レーザ加工機、レーザ加工方法、板材加工システム、及び板材加工方法
Abstract:
(EN) Provided are: a laser processing machine capable of easily and efficiently transferring a workpiece by making it possible to lift a workpiece placing section for placing the workpiece; and a laser processing method. This laser processing machine is provided with: a laser head (4), which relatively moves with respect to a board-like workpiece (W) disposed in a processing region (R1), and which processes the workpiece (W); a workpiece placing section (6) capable of traveling with the workpiece (W) placed thereon; and a lift device (2) capable of disposing the workpiece (W) in the processing region by lifting the workpiece placing section (6) on which the workpiece (W) is placed.
(FR) L'invention concerne : une machine de traitement au laser en mesure de transférer de manière facile et efficace une pièce à travailler car elle permet de soulever une section de positionnement de pièce à travailler pour positionner la pièce à travailler ; et concerne aussi un procédé de traitement au laser. Cette machine de traitement au laser comporte : une tête laser (4), qui se déplace de manière relative par rapport à une pièce à travailler semblable à une carte (W) disposée dans une région de traitement (R1), et qui traite la pièce à travailler (W) ; une section de positionnement de pièce à travailler (6) en mesure de se déplacer avec la pièce à travailler (W) positionnée sur celle-ci ; et un dispositif de levage (2) en mesure de disposer la pièce à travailler (W) dans la région de traitement en soulevant la section de positionnement de pièce à travailler (6) sur laquelle la pièce à travailler (W) est placée.
(JA) ワークを載置するワーク載置部を昇降可能にして、ワークを容易かつ効率よく移載することが可能なレーザ加工機及びレーザ加工方法を提供する。加工領域(R1)に配置された板状のワーク(W)に対して相対的に移動してワーク(W)を加工するレーザヘッド(4)と、ワーク(W)を載置して走行可能なワーク載置部(6)と、ワーク(W)を載置したワーク載置部(6)を昇降させてワーク(W)を加工領域に配置可能な昇降装置(2)とを備える。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)