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1. (WO2017003613) METHOD AND DEVICE FOR COUPLING MULTIPLE GROUND PLANES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/003613 International Application No.: PCT/US2016/034851
Publication Date: 05.01.2017 International Filing Date: 27.05.2016
IPC:
H01R 13/648 (2006.01) ,H01R 4/64 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
13
Details of coupling devices of the kinds covered by groups H01R12/7087
648
Protective earth or shield arrangements on coupling devices
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
58
characterised by the form or material of the contacting members
64
Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Blvd Santa Clara, CA 95052, US
Inventors:
BENNETT, Douglas, G.; US
Agent:
PFLEGER, Edmund, P.; US
Priority Data:
14/752,87627.06.2015US
Title (EN) METHOD AND DEVICE FOR COUPLING MULTIPLE GROUND PLANES
(FR) PROCÉDÉ ET DISPOSITIF DE COUPLAGE DE MULTIPLES RETOURS DE MASSE
Abstract:
(EN) Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.
(FR) De manière générale, la présente invention concerne des systèmes, des dispositifs et des procédés pour un meilleur couplage électrique de multiples retours de masse d'un dispositif. Le dispositif peut comprendre une pluralité de retours de masse et une attache de mise à la terre électroconductrice. L'attache de mise à la terre peut comprendre une partie de base conçue pour fixer l'attache de mise à la terre au dispositif et une pluralité de doigts de diaphragme. Chacun des doigts de diaphragme peut être conçu pour venir en contact et se coupler électriquement à un retour de la pluralité de retours de masse, l'attache de mise à la terre étant destinée à fournir un chemin de conduction entre chacun des doigts de diaphragme. L'un des doigts de diaphragme peut passer par une ouverture ou une découpe dans un premier retour de masse de manière à entrer en contact avec un second retour de masse. Le dispositif peut être une plate-forme de calcul ou de communication mobile.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020180014218CN107683549EP3314704JP2018528564