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1. (WO2017002445) SPUTTERING TARGET ASSEMBLY
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/002445 International Application No.: PCT/JP2016/063552
Publication Date: 05.01.2017 International Filing Date: 02.05.2016
IPC:
C23C 14/34 (2006.01) ,H01L 21/203 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
34
Sputtering
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
20
Deposition of semiconductor materials on a substrate, e.g. epitaxial growth
203
using physical deposition, e.g. vacuum deposition, sputtering
Applicants:
株式会社コベルコ科研 KOBELCO RESEARCH INSTITUTE, INC. [JP/JP]; 兵庫県神戸市中央区脇浜海岸通1丁目5番1号 1-5-1, Wakinohama-kaigan-dori, Chuo-ku, Kobe-shi, Hyogo 6510073, JP
Inventors:
高木 勝寿 TAKAGI, Katsutoshi; --
金丸 守賀 KANAMARU, Moriyoshi; --
廣瀬 研太 HIROSE, Kenta; --
岩崎 祐紀 IWASAKI, Yuki; --
Agent:
鮫島 睦 SAMEJIMA, Mutsumi; JP
Priority Data:
2015-13096930.06.2015JP
Title (EN) SPUTTERING TARGET ASSEMBLY
(FR) ENSEMBLE DE CIBLES DE PULVÉRISATION
(JA) スパッタリングターゲット組立体
Abstract:
(EN) Provided is a sputtering target assembly that includes a plurality of mounting sections which are disposed on a backing plate, which are disposed with a gap therebetween, and on each of which one or more sputtering target members are disposed via a bonding material. The sputtering target assembly has a Ni base material coating in gaps between the adjacent mounting sections.
(FR) L'invention concerne un ensemble de cibles de pulvérisation qui comprend une pluralité de sections de montage qui sont disposées sur une plaque de support, qui sont ménagées en laissant un espace entre elles, et sur chacune desquelles un ou plusieurs éléments formant cibles de pulvérisation sont disposés via un matériau de liaison. L'ensemble de cibles de pulvérisation comporte un revêtement dans une matière à base de Ni dans les espaces entre les sections de montage adjacentes.
(JA) バッキングプレート上に配置された複数の載置部であって、互いに間隔を空けて配置され、それぞれの上にボンディング材を介して、1つ以上のスパッタリングターゲット部材が配置された複数の載置部を含み、隣り合う前記載置部の間の隙間部にNi基材料のコーティングを有するスパッタリングターゲット組立体である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN107636194KR1020180012310