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1. (WO2017002430) ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN MOLDING METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2017/002430 International Application No.: PCT/JP2016/062227
Publication Date: 05.01.2017 International Filing Date: 18.04.2016
IPC:
G03F 7/075 (2006.01) ,G03F 7/004 (2006.01) ,G03F 7/038 (2006.01) ,G03F 7/039 (2006.01) ,G03F 7/32 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
075
Silicon-containing compounds
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
04
Chromates
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
038
Macromolecular compounds which are rendered insoluble or differentially wettable
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
039
Macromolecular compounds which are photodegradable, e.g. positive electron resists
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26
Processing photosensitive materials; Apparatus therefor
30
Imagewise removal using liquid means
32
Liquid compositions therefor, e.g. developers
Applicants:
富士フイルム株式会社 FUJIFILM CORPORATION [JP/JP]; 東京都港区西麻布2丁目26番30号 26-30, Nishiazabu 2-chome, Minato-ku, Tokyo 1068620, JP
Inventors:
後藤 研由 GOTO Akiyoshi; JP
畠山 直也 HATAKEYAMA Naoya; JP
加藤 啓太 KATO Keita; JP
王 惠瑜 OU Keiyu; JP
Agent:
中島 順子 NAKASHIMA Junko; JP
Priority Data:
2015-13297901.07.2015JP
Title (EN) ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN MOLDING METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD
(FR) COMPOSITION DE RÉSINE SENSIBLE AUX RAYONS ACTINIQUES OU AU RAYONNEMENT, FILM SENSIBLE AUX RAYONS ACTINIQUES OU AU RAYONNEMENT, PROCÉDÉ DE MOULAGE PAR MOTIF ET PROCÉDÉ DE PRODUCTION D'UN DISPOSITIF ÉLECTRONIQUE
(JA) 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、パターン形成方法及び電子デバイスの製造方法
Abstract:
(EN) Provided are: an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) that includes a repeating unit (a) having an Si atom, a crosslinking agent (B), and a compound (C) that generates an acid upon irradiation with active light or radiation (with the caveat that a repeating unit having the Si atom has a structure in which a polar group is protected by a leaving group that is decomposed and removed by the action of the acid, and if the Si atom is only included in the leaving group, the repeating unit is not included in the repeating unit (a)); an actinic ray-sensitive or radiation-sensitive film that includes the actinic ray-sensitive or radiation-sensitive resin composition; a pattern molding method using the actinic ray-sensitive or radiation-sensitive resin composition; and an electronic device production method using the pattern molding method.
(FR) La présente invention concerne : une composition de résine sensible aux rayons actiniques ou au rayonnement contenant une résine (A) qui comprend un motif répétitif (a) comprenant un atome de Si, un agent de réticulation (B) et un composé (C) qui génère un acide lors de l'irradiation avec une lumière ou un rayonnement actif (à condition qu'un motif répétitif comprenant l'atome de Si présente une structure dans laquelle un groupe polaire est protégé par un groupe partant qui est décomposé et éliminé par l'action de l'acide, et si l'atome de Si n'est inclus que dans le groupe partant, le motif répétitif n'est pas inclus dans le motif répétitif (a)) ; un film sensible aux rayons actiniques ou au rayonnement qui comprend la composition de résine sensible aux rayons actiniques ou au rayonnement ; un procédé de moulage par motif à l'aide de la composition de résine sensible aux rayons actiniques ou au rayonnement et un procédé de production d'un dispositif électronique à l'aide du procédé de moulage par motif.
(JA) Si原子を有する繰り返し単位(a)を含む樹脂(A)、架橋剤(B)、及び活性光線又は放射線の照射により酸を発生する化合物(C)を含有する感活性光線性又は感放射線性樹脂組成物(但し、Si原子を有する繰り返し単位が、酸の作用により分解し脱離する脱離基で極性基が保護された構造を有し、かつ、前記脱離基のみにSi原子を含む場合、該繰り返し単位は前記繰り返し単位(a)には含まれない)、上記感活性光線性又は感放射線性樹脂組成物を含む感活性光線性又は感放射線性膜、上記感活性光線性又は感放射線性樹脂組成物を用いたパターン形成方法、及び、上記パターン形成方法を含む電子デバイスの製造方法。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
JPWO2017002430