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1. (WO2016194920) SOLVENT-FREE LIGHT-CURABLE ADHESIVE COMPOSITION
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2016/194920 International Application No.: PCT/JP2016/066098
Publication Date: 08.12.2016 International Filing Date: 01.06.2016
IPC:
C09J 179/04 (2006.01) ,C09J 4/00 (2006.01) ,C09J 4/02 (2006.01) ,C09J 7/00 (2006.01) ,C09J 11/06 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
179
Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/-C09J177/263
04
Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
4
Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
02
Acrylmonomers
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7
Adhesives in the form of films or foils
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11
Features of adhesives not provided for in group C09J9/76
02
Non-macromolecular additives
06
organic
Applicants:
日産化学工業株式会社 NISSAN CHEMICAL INDUSTRIES, LTD. [JP/JP]; 東京都千代田区神田錦町三丁目7番地1 7-1, Kanda Nishiki-cho 3-chome, Chiyoda-ku, Tokyo 1010054, JP
Inventors:
前田 大輔 MAEDA Daisuke; JP
西村 直也 NISHIMURA Naoya; JP
Agent:
特許業務法人英明国際特許事務所 PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE; 東京都中央区銀座二丁目16番12号 銀座大塚ビル2階 GINZA OHTSUKA Bldg. 2F, 16-12, Ginza 2-chome, Chuo-ku, Tokyo 1040061, JP
Priority Data:
2015-11220502.06.2015JP
2015-21666004.11.2015JP
Title (EN) SOLVENT-FREE LIGHT-CURABLE ADHESIVE COMPOSITION
(FR) COMPOSITION ADHÉSIVE DURCISSABLE À LA LUMIÈRE, EXEMPTE DE SOLVANT
(JA) 無溶剤型光硬化性接着剤用組成物
Abstract:
(EN) A solvent-free light-curable adhesive composition includes: for example, a triazine ring-containing polymer including a repeating unit structure represented by formula [3] and having a weight-average molecular weight of 500-5000; and a reactive diluent such as N-vinylformamide, the composition not including a solvent. The solvent-free light-curable adhesive composition has good compatibility with acrylic materials and the like, which are adhesive components, even without including a solvent.
(FR) La présente invention concerne une composition adhésive durcissable à la lumière, exempte de solvant comprenant : par exemple, un polymère contenant un cycle triazine comprenant une structure de motif répété représentée par la formule [3] et ayant une masse moléculaire moyenne en poids de 500 à 5 000; et un diluant réactif tel que le N-vinylformamide, ladite composition ne comprenant pas de solvant. Ladite composition adhésive durcissable à la lumière, exempte de solvant présente une bonne compatibilité avec des matériaux acryliques et analogues, qui sont des composants adhésifs, même sans comprendre de solvant.
(JA) 例えば、下記式[3]で表されるような繰り返し単位構造を含み、重量平均分子量が500~5,000のトリアジン環含有重合体と、N-ビニルホルムアミド等の反応性希釈剤とを含み、溶媒を含まない無溶剤型光硬化性接着剤用組成物は、溶媒を含まないにもかかわらず、接着剤成分であるアクリル系材料等との相溶性が良好である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)