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1. WO2016190149 - MANUFACTURING METHOD FOR AIRTIGHT PACKAGE

Publication Number WO/2016/190149
Publication Date 01.12.2016
International Application No. PCT/JP2016/064434
International Filing Date 16.05.2016
IPC
H01L 23/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
H01L 23/08 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
06characterised by the material of the container or its electrical properties
08the material being an electrical insulator, e.g. glass
H03H 9/02 2006.01
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02Details
CPC
B29C 65/16
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining ; or sealing; of preformed parts ; , e.g. welding of plastics materials; Apparatus therefor
02by heating, with or without pressure
14using wave energy ; , i.e. electromagnetic radiation,; or particle radiation
16Laser beams
B29C 65/48
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
65Joining ; or sealing; of preformed parts ; , e.g. welding of plastics materials; Apparatus therefor
48using adhesives ; , i.e. using supplementary joining material; solvent bonding
B29L 2031/712
BPERFORMING OPERATIONS; TRANSPORTING
29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
2031Other particular articles
712Containers; Packaging elements or accessories, Packages
B32B 17/00
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
17Layered products essentially comprising sheet glass, or glass, slag, or like fibres
C03C 2207/00
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
2207Compositions specially applicable for the manufacture of vitreous enamels
C03C 3/066
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
3Glass compositions
04containing silica
062with less than 40% silica by weight
064containing boron
066containing zinc
Applicants
  • 日本電気硝子株式会社 NIPPON ELECTRIC GLASS CO., LTD. [JP]/[JP]
Inventors
  • 白神 徹 SHIRAGAMI Toru
  • 荒川 浩士 ARAKAWA Hiroshi
Priority Data
2015-10817628.05.2015JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) MANUFACTURING METHOD FOR AIRTIGHT PACKAGE
(FR) PROCÉDÉ DE FABRICATION D'EMBALLAGE ÉTANCHE À L'AIR
(JA) 気密パッケージの製造方法
Abstract
(EN)
This manufacturing method for an airtight package is characterized by including the following: (1) a step for preparing a first glass substrate and forming a first sealing material layer on the first glass substrate; (2) a step for preparing a frame having an opening at the top thereof, disposing the frame and the first glass substrate such that the bottom of the frame is in contact with the first sealing material layer, and then sealing together the frame and the first glass substrate with the first sealing material layer therebetween; (3) a step for forming a second sealing material layer on a top edge portion of the frame; (4) a step for storing a member to be stored inside the frame; and (5) a step for preparing a second glass substrate, disposing the second glass substrate such that the second glass substrate is in contact with the second sealing material layer, and then radiating a laser beam towards the second sealing material layer from the second glass substrate-side to seal the second glass substrate and the frame with the second sealing material layer therebetween, thereby obtaining an airtight package.
(FR)
Le procédé de fabrication d'emballage étanche à l'air selon la présente invention est caractérisé en ce qu'il comprend les éléments suivants : (1) une étape de préparation d'un premier substrat en verre et de formation d'une première couche de matière d'étanchéité sur le premier substrat en verre ; (2) une étape de préparation d'un cadre ayant une ouverture au niveau de sa partie supérieure, de disposition du cadre et du premier substrat en verre de telle sorte que la partie inférieure du cadre est en contact avec la première couche de matière d'étanchéité, et ensuite de scellement conjoint du cadre et du premier substrat en verre ayant la première couche de matière d'étanchéité entre ces derniers ; (3) une étape de formation d'une seconde couche de matière d'étanchéité sur une partie de bord supérieur du cadre ; (4) une étape de stockage d'un élément à stocker à l'intérieur du cadre ; et (5) une étape de préparation d'un second substrat en verre, de disposition du second substrat en verre de telle sorte que le second substrat en verre est en contact avec la seconde couche de matière d'étanchéité, et puis de rayonnement d'un faisceau laser vers la seconde couche de matière d'étanchéité depuis le côté du second substrat en verre pour sceller le second substrat en verre et le cadre à l'aide de la seconde couche de matière d'étanchéité entre ces derniers, ce qui permet d'obtenir un emballage étanche à l'air.
(JA)
 本発明の気密パッケージの製造方法は、(1)第一のガラス基板を用意すると共に、第一のガラス基板上に第一の封着材料層を形成する工程と、(2)上部に開口部を有する枠体を用意すると共に、枠体の底部と第一の封着材料層が接触するように、枠体と第一のガラス基板を配置した後、第一の封着材料層を介して枠体と第一のガラス基板を封着する工程と、(3)枠体の上縁部に第二の封着材料層を形成する工程と、(4)枠体内に収容部材を収容する工程と、(5)第二のガラス基板を用意すると共に、第二のガラス基板と第二の封着材料層が接触するように、第二のガラス基板を配置した後、レーザー光を第二のガラス基板側から第二の封着材料層に向けて照射し、第二の封着材料層を介して第二のガラス基板と枠体を封着して、気密パッケージを得る工程と、を備えることを特徴とする。
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