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1. WO2016185996 - SOLDER CONNECTION STRUCTURE AND FILM FORMING METHOD

Publication Number WO/2016/185996
Publication Date 24.11.2016
International Application No. PCT/JP2016/064122
International Filing Date 12.05.2016
IPC
C23C 24/04 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
24Coating starting from inorganic powder
02by application of pressure only
04Impact or kinetic deposition of particles
B23K 1/20 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K 35/26 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400°C
C22C 19/03 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
19Alloys based on nickel or cobalt
03based on nickel
CPC
B23K 1/20
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K 35/24
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
B23K 35/26
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400 degrees C
B23K 35/3033
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
30with the principal constituent melting at less than 1550 degrees C
3033Ni as the principal constituent
C22C 19/03
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
19Alloys based on nickel or cobalt
03based on nickel
C23C 24/04
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
24Coating starting from inorganic powder
02by application of pressure only
04Impact or kinetic deposition of particles
Applicants
  • タツタ電線株式会社 TATSUTA ELECTRIC WIRE & CABLE CO., LTD. [JP]/[JP]
Inventors
  • 平野 正樹 HIRANO, Masaki
Agents
  • 特許業務法人HARAKENZO WORLD PATENT & TRADEMARK HARAKENZO WORLD PATENT & TRADEMARK
Priority Data
2015-10123518.05.2015JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SOLDER CONNECTION STRUCTURE AND FILM FORMING METHOD
(FR) STRUCTURE DE RACCORDEMENT PAR BRASURE ET PROCÉDÉ DE FORMATION DE FILM
(JA) 半田接続構造、及び成膜方法
Abstract
(EN)
Provided are: a solder connection structure for improving the solder wettability; and a film forming method for forming a metal film on an aluminum base. This solder connection structure (50) is to be connected with another member through the intermediary of a solder material, and is provided with an aluminum substrate (30) and a metal film (40) that is formed on the aluminum substrate (30) by a cold spray method using a mixed powder material which is obtained by mixing an Ni powder (41) with an Sn powder (42).
(FR)
Cette invention concerne : une structure de raccordement par brasure pour améliorer la mouillabilité de la brasure; et un procédé de formation de film pour la formation d'un film métallique sur une base d'aluminium. Ladite structure de raccordement par brasure (50) est conçue pour être raccordée à un autre élément par l'intermédiaire d'un matériau de brasure, et elle est pourvue d'un substrat d'aluminium (30) et d'un film métallique (40) qui est formé sur le substrat d'aluminium (30) par un procédé de pulvérisation à froid mettant en œuvre un matériau de poudre mixte qui est obtenu par mélange d'une poudre de Ni (41) avec une poudre de Sn (42).
(JA)
半田濡れ性を向上させるための、半田接続構造、及び、アルミニウム基材上に金属膜を成膜する成膜方法を提供する。半田接続構造(50)は、半田材料を介して他の部材と接続するものであり、アルミニウム基板(30)と、Ni粉末(41)と、Sn粉末(42)とが混合された混合粉末材料を用いたコールドスプレー法によりアルミニウム基板(30)上に成膜された金属膜(40)と、を備える。
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