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1. (WO2016185672) SOLDER ALLOY
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/185672    International Application No.:    PCT/JP2016/002169
Publication Date: 24.11.2016 International Filing Date: 25.04.2016
B23K 35/26 (2006.01), C22C 13/00 (2006.01), H05K 3/34 (2006.01)
Applicants: NEC CORPORATION [JP/JP]; 7-1, Shiba 5-chome, Minato-ku, Tokyo 1088001 (JP)
Inventors: MOMOKAWA, Yuuki; (JP)
Agent: SHIMOSAKA, Naoki; (JP)
Priority Data:
2015-102914 20.05.2015 JP
(JA) はんだ合金
Abstract: front page image
(EN)In order to improve the strength and elongation of a solder and improve the reliability of a joining portion joined by said solder, the present invention provides a solder alloy that comprises 2.0-4.0 mass% of Ag, 0.5-1.0 mass% of Cu, 0.1-1.0 mass% of Sb, 0.1-0.5 mass% of an additive element selected from the group consisting of Ca, Mn, and Al, and a balance of Sn.
(FR)L'invention vise à améliorer la résistance et l'allongement d'une brasure et à améliorer la fiabilité d'une partie de jonction jointe par ladite brasure. A cet effet, la présente invention propose un alliage de brasure qui comprend de 2,0 à 4,0 % en masse d'Ag, de 0,5 à 1,0 % en masse de Cu, de 0,1 à 1,0 % en masse de Sb, de 0,1 à 0,5 % en masse d'un élément additif choisi dans le groupe constitué de Ca, Mn et Al, le reste étant du Sn.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)