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Machine translation
1. (WO2016182191) WAFER HEATING APPARATUS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/182191    International Application No.:    PCT/KR2016/003046
Publication Date: 17.11.2016 International Filing Date: 25.03.2016
IPC:
H01L 21/324 (2006.01), H01L 21/027 (2006.01), H01L 21/02 (2006.01), H01L 21/683 (2006.01), C08L 101/00 (2006.01)
Applicants: DAE WHA ALLOYTECH CO.,LTD [KR/KR]; 17-60, Saneopdanji-gil, Myeoncheon-myeon Dangjin-si Chungcheongnam-do 31806 (KR)
Inventors: KIM, Yoon Jin; (KR).
CHO, Jin Woo; (KR).
SHIN, Kwon Woo; (KR).
PARK, Ji Sun; (KR)
Agent: JIN, Cheon Woong; (KR)
Priority Data:
10-2015-0067163 14.05.2015 KR
Title (EN) WAFER HEATING APPARATUS
(FR) APPAREIL DE CHAUFFAGE DE PLAQUETTE
(KO) 웨이퍼 히팅장치
Abstract: front page image
(EN)The present invention relates to a wafer heating apparatus comprising: a gas supply pipe for supplying heated gas to a wafer positioned inside a chamber; and a heating unit for heating gas flowing in the gas supply pipe, wherein the heating unit comprises a heating paste composition; wherein the heating paste composition contains, on the basis of 100 parts by weight of the heating paste composition, 3-6 parts by weight of carbon nanotube particles, 0.5-30 parts by weight of carbon nanoparticles, 10-30 parts by weight of a mixed binder, 29-83 parts by weight of an organic solvent, and 0.5-5 parts by weight of a dispersant; and wherein the mixed binder is a mixture of epoxy acrylate, a polyvinyl acetal, and a phenol-based resin, or a mixture of hexamethylene diisocyanate, a polyvinyl acetal, and a phenol-based resin.
(FR)La présente invention concerne un appareil de chauffage de plaquette comprenant : un tuyau d'alimentation en gaz pour apporter du gaz chauffé à une plaquette positionnée à l'intérieur d'une chambre ; et une unité de chauffage pour chauffer le gaz s'écoulant dans le tuyau d'alimentation en gaz, l'unité de chauffage comprenant une composition de pâte de chauffage ; la composition de pâte de chauffage contient, sur la base de 100 parts en poids de la composition de pâte de chauffage, de 3 à 6 parts en poids de particules de nanotubes de carbone, de 0,5 à 30 parts en poids de nanoparticules de carbone, de 10 à 30 parts en poids d'un liant mixte, de 29 à 33 parts en poids d'un solvant organique, et de 0,5 à 5 parts en poids d'un dispersant ; et le liant mixte est un mélange d'acrylate époxy, d'un acétal de polyvinyle et d'une résine à base de phénol, ou un mélange de diisocyanate d'hexaméthylène, d'un acétal de polyvinyle et d'une résine à base de phénol.
(KO)본 발명은, 챔버 내부에 위치하는 웨이퍼에 가열된 가스를 공급하는 가스 공급관; 및 상기 가스 공급관을 유동하는 가스를 가열하는 가열수단을 포함하며, 상기 가열수단은 발열 페이스트 조성물을 포함하며, 상기 발열 페이스트 조성물은, 발열 페이스트 조성물 100 중량부에 대하여 탄소나노튜브 입자 3 내지 6중량부, 탄소나노입자 0.5 내지 30중량부, 혼합 바인더 10 내지 30중량부, 유기 용매 29 내지 83 중량부 및 분산제 0.5 내지 5중량부를 포함하며, 상기 혼합 바인더는 에폭시 아크릴레이트, 폴리비닐 아세탈 및 페놀계 수지가 혼합되거나 헥사메틸렌 디이소시아네이트, 폴리비닐 아세탈 및 페놀계 수지가 혼합되는 웨이퍼 히팅장치에 관한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)