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Pub. No.:    WO/2016/181889    International Application No.:    PCT/JP2016/063598
Publication Date: 17.11.2016 International Filing Date: 02.05.2016
C09K 3/14 (2006.01), B24B 37/00 (2012.01), H01L 21/304 (2006.01)
Applicants: FUJIMI INCORPORATED [JP/JP]; 1-1, Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-shi, Aichi 4528502 (JP)
Inventors: ODA Hiroyuki; (JP).
MORI Yoshio; (JP).
TAKAMI Shinichiro; (JP).
TABATA Makoto; (JP)
Agent: MORI Tetsuya; (JP)
Priority Data:
2015-095660 08.05.2015 JP
(JA) 研磨用組成物
Abstract: front page image
(EN)The present invention relates to a polishing composition which is favorably used in polishing primarily semiconductor substrates of silicon wafers, etc., and other objects to be polished, and which can obtain excellent flatness. Defining Wp as the conformability of the polishing composition to a polishing pad, Ww as conformability thereof to an object to be polished, and Wc as conformability to a tool for holding the object to be polished, the value of Wc is the smallest of these.
(FR) L'invention concerne une composition de polissage utilisée avantageusement pour le polissage principalement de substrats semi-conducteurs tels que plaquettes de silicium et similaires ou pour d'autres objets à polir, laquelle composition permet en outre d'obtenir un degré de planéité satisfaisant. Si Wp représente la conformabilité de la composition de polissage pour un tampon à polir, Ww représente la conformabilité de la composition de polissage pour un objet à polir et Wc la conformabilité de la composition de polissage pour un outil maintenant l'objet à polir, la valeur de Wc est la plus petite.
(JA) 本発明は、主にシリコンウェーハ等の半導体基板その他の研磨対象物の研磨に好ましく用いられる研磨用組成物に関するものであり、良好な平坦度を得る研磨用組成物を提供する。研磨用組成物の、研磨パッドに対するなじみ性をWp、研磨対象物に対するなじみ性をWw、研磨対象物保持具に対するなじみ性をWcとしたとき、Wcの値が最も小さい。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)