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Machine translation
1. (WO2016181500) LASER MACHINING DEVICE AND LASER MACHINING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2016/181500    International Application No.:    PCT/JP2015/063639
Publication Date: 17.11.2016 International Filing Date: 12.05.2015
IPC:
B23K 26/02 (2014.01)
Applicants: MITSUBISHI ELECTRIC CORPORATION [JP/JP]; 7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008310 (JP)
Inventors: HORIGUCHI, Takayoshi; (JP)
Agent: TAKAMURA, Jun; (JP)
Priority Data:
Title (EN) LASER MACHINING DEVICE AND LASER MACHINING METHOD
(FR) DISPOSITIF D'USINAGE LASER ET PROCÉDÉ D'USINAGE LASER
(JA) レーザ加工装置及びレーザ加工方法
Abstract: front page image
(EN)Provided is a laser machining device (1) that includes: a processing head (4) for irradiating a workpiece (W) with laser light (LL) and processing the workpiece (W); tables (2, 2a-2g) on which the workpiece (W) is carried, and which have at least two marks (3, 3A-3C); drive devices (10, 20) for changing the relative position of the processing head (4) and the tables (2, 2a-2g); a reader device (8) for reading the marks (3, 3A-3C); and a mechanism (4G) for correcting the direction of irradiation of the laser light (LL) using the locations of the marks (3, 3A-3C) obtained through reading out of the marks (3, 3A-3C) by the reader device (8).
(FR)L'invention concerne un dispositif d'usinage laser (1) qui comprend : une tête de traitement (4) pour exposer une pièce (W) à une lumière laser (LL) et traiter la pièce (W) ; des tables (2, 2a-2g) sur lesquelles la pièce (W) est portée, et qui ont au moins deux marques (3, 3A-3C) ; des dispositifs d'entraînement (10, 20) pour changer la position relative de la tête de traitement (4) et des tables (2, 2a-2g) ; un dispositif de lecture (8) pour lire les marques (3, 3A-3C) ; et un mécanisme (4G) pour corriger la direction de rayonnement de la lumière laser (LL) en utilisant les emplacements des marques (3, 3A-3C) obtenus en lisant les marques (3, 3A-3C) au moyen du dispositif de lecture (8).
(JA)レーザ加工装置(1)は、ワーク(W)にレーザ光(LL)を照射して前記ワーク(W)を加工する加工ヘッド(4)と、前記ワーク(W)を載置し、かつ少なくとも2個のマーク(3,3A~3C)を有するテーブル(2,2a~2g)と、前記加工ヘッド(4)と前記テーブル(2,2a~2g)との相対位置を変更する駆動装置(10,20)と、前記マーク(3,3A~3C)を読み取る読取装置(8)と、前記読取装置(8)が前記マーク(3,3A~3C)を読み取ることによって得られた前記マーク(3,3A~3C)の位置を用いて前記レーザ光(LL)の照射方向を補正する機構(4G)と、を含む。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)