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1. (WO2016180779) OPTOELECTRONIC SEMICONDUCTOR CHIP
PCT Biblio. Data
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Pub. No.:
WO/2016/180779
International Application No.:
PCT/EP2016/060333
Publication Date:
17.11.2016
International Filing Date:
09.05.2016
IPC:
H01L 33/14
(2010.01)
H
ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
characterised by the semiconductor bodies
14
with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
Applicants:
OSRAM OPTO SEMICONDUCTORS GMBH
[DE/DE]; Leibnizstr. 4 93055 Regensburg (DE)
Inventors:
KOPP, Fabian
; (DE).
MOLNAR, Attila
; (MY)
Agent:
EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHAFT MBH
; Schloßschmidstr. 5 80639 München (DE)
Priority Data:
10 2015 107 577.6
13.05.2015
DE
Title
(DE)
OPTOELEKTRONISCHER HALBLEITERCHIP
(EN)
OPTOELECTRONIC SEMICONDUCTOR CHIP
(FR)
PUCE SEMI-CONDUCTRICE OPTOÉLECTRONIQUE
Abstract:
(DE)
Die Erfindung betrifft einen optoelektronischen Halbleiterchip (100), umfassend mindestens eine n-dotierte Halbleiterschicht (3), mindestens eine p-dotierte Halbleiterschicht (5) und eine zwischen der mindestens einen n-dotierten Halbleiterschicht (3) und der mindestens einen p-dotierten Halbleiterschicht (5) angeordnete aktive Schicht (4), wobei die p-dotierte Halbleiterschicht (5) mittels eines p- Anschlusskontakts (8) elektrisch kontaktiert ist, wobei unterhalb des p-Anschlusskontakts (8) ein Graben (10) angeordnet ist, der sich zumindest teilweise in die p- dotierte Halbleiterschicht (5) erstreckt, wobei zumindest zwischen der n-dotierten Halbleiterschicht (3) und dem p- Anschlusskontakt (8) ein Blockierelement (6) angeordnet ist, daszumindest teilweise unterhalb des p-Anschlusskontakts (8) und zumindest teilweise innerhalb des Grabens (10) angeordnet ist, wobei das Blockierelement (6) elektrisch isoliert, wobei durch das Blockierelement (6) ein direkter Stromfluss zwischen dem p-Anschlusskontakt (8) und den p-und n- dotierten Halbleiterschichten (3,5) und der aktiven Schicht (4) verhindert ist.
(EN)
The invention relates to an optoelectronic semiconductor chip (100) comprising at least one n-type semiconductor layer (3), at least one p-type semiconductor layer (5), and an active layer (4) arranged between the at least one n-type semiconductor layer (3) and the at least one p-type semiconductor layer (5), wherein the p-type semiconductor layer (5) is electrically contacted by means of a p-connection contact (8), wherein a trench (10) is arranged underneath the p-connection contact (8), which trench (10) at least partially extends into the p-type semiconductor layer (5), wherein a blocking element (6) is arranged at least between the n-type semiconductor layer (3) and the p-connection contact (8), and which blocking element is arranged at least partially underneath the p-connection contact (8) and at least partially inside the trench (10), wherein the blocking element (6) is electrically isolated, wherein a direct current flow is prevented between the p-connection contact (8) and the p- and n-type semiconductor layers (3, 5) and the active layer (4).
(FR)
L'invention concerne une puce semi-conductrice optoélectronique (100), comportant au moins une couche semi-conductrice dopée N (3), au moins une couche semi-conductrice dopée P (5) et une couche active (4) disposée entre la ou les couches semi-conductrices dopées N (3) et la ou les couches semi-conductrices dopées P (5). Ladite puce (100) est caractérisée en ce que : la couche semi-conductrice dopée P (5) est mise en contact électrique au moyen d’un contact de branchement P (8) ; en dessous du contact de branchement P (8) est disposé un fossé (10) qui s’étend au moins en partie dans la couche semi-conductrice dopée P (5) ; au moins entre la couche semi-conductrice dopée N (3) et le contact de branchement P (8) est disposé un élément de blocage (6) qui est disposé au moins en partie en dessous du contact de branchement P (8) et au moins en partie à l’intérieur du fossé (10) ; l’élément de blocage (6) est isolé électriquement ; et l’élément de blocage (6) empêche un flux de courant entre le contact de branchement P (8) et les couches semi-conductrices dopées N et P (3, 5) et la couche active (4).
Designated States:
AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG).
Publication Language:
German (
DE
)
Filing Language:
German (
DE
)